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TL852CDRG4

Texas Instruments

TL852CDRG4 by Texas Instruments

TL852CDRG4 by Texas Instruments is a 16-terminal telecom IC with 5V supply voltage. It operates b/w 0-40°C, using bipolar technology and consuming 0.045mA max supply current. Ideal for telecom circuits, it features a small outline package style and Gull Wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,033 parts In-Stock

1+ parts

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2,033

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Digiode

USA . 1,414 parts In-Stock

1+ parts

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1,414

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 820 parts In-Stock

1+ parts

$10.098

100+ parts

-

1k+ parts

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820

$10.098

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Parana Technologies

USA . 492 parts In-Stock

1+ parts

$14.575

100+ parts

-

1k+ parts

$15.012

10k+ parts

-

492

$14.575

-

$15.012

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DigiPath Technology Company

USA . 1,740 parts In-Stock

1+ parts

$16.048

100+ parts

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10k+ parts

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1,740

$16.048

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ChromeModa Solutions

Germany . 2,964 parts In-Stock

1+ parts

$16.376

100+ parts

$13.428

1k+ parts

-

10k+ parts

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2,964

$16.376

$13.428

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IDEA Electronic Components Group

UK . 744 parts In-Stock

1+ parts

$16.376

100+ parts

$15.557

1k+ parts

$14.738

10k+ parts

-

744

$16.376

$15.557

$14.738

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One Stop Electronics

USA . 1,290 parts In-Stock

1+ parts

$522.000

100+ parts

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1,290

$522.000

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Corphita

USA . 2,806 parts In-Stock

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2,806

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Overview

Experience seamless communication with the TL852CDRG4 by Texas Instruments, a top-tier manufacturer renowned for its quality products. This innovative telecom interface IC is designed to enhance connectivity in various applications. Benefit from its reliability and efficiency, all while enjoying the value it brings to your projects. Upgrade to the TL852CDRG4 today and discover a world of possibilities in telecommunications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for use in various telecom applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient PCB assembly, saving time and effort during the manufacturing process.

Power Supplies (V): 5

Operating at 5V provides sufficient power for the telecom interface ICs to function effectively, ensuring reliable performance.

Maximum Operating Temperature: 40 °C

With a maximum operating temperature of 40°C, the product can withstand heat during operation, enhancing its durability and reliability.

Technology: BIPOLAR

The use of bipolar technology in the product ensures high-speed performance and accuracy, making it an ideal choice for telecom interface applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides a stable power source for the telecom interface ICs, ensuring consistent and reliable operation.

Technical Specifications

Other Function Telecom Interface ICs TL852CDRG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.045 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TL852CDRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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