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TL853CN

Texas Instruments

TL853CN by Texas Instruments

TL853CN by Texas Instruments is a telecom circuit IC with 5V power supply, operating temperature range of 0-70°C. It features through-hole terminal form and is designed for commercial-grade applications in telecom interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,619 parts In-Stock

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5,619

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Digiode

USA . 1,892 parts In-Stock

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1,892

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,249 parts In-Stock

1+ parts

$6.293

100+ parts

-

1k+ parts

$7.046

10k+ parts

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2,249

$6.293

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$7.046

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ChromeModa Solutions

Germany . 6,968 parts In-Stock

1+ parts

$7.071

100+ parts

$5.798

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6,968

$7.071

$5.798

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IDEA Electronic Components Group

UK . 2,005 parts In-Stock

1+ parts

$7.071

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-

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$6.364

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2,005

$7.071

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$6.364

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AZTECH Wire

Italy . 811 parts In-Stock

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$14.909

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811

$14.909

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Semicontronic

India . 1,200 parts In-Stock

1+ parts

$104.000

100+ parts

$101.400

1k+ parts

$100.880

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1,200

$104.000

$101.400

$100.880

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One Stop Electronics

USA . 385 parts In-Stock

1+ parts

$855.000

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385

$855.000

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Ampacity Inc.

Singapore . 1,479 parts In-Stock

1+ parts

$949.000

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1,479

$949.000

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Corphita

USA . 3,058 parts In-Stock

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3,058

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DigiPath Technology Company

USA . 606 parts In-Stock

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$6.375

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606

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$6.375

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Corohmni

South Africa . 158 parts In-Stock

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158

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Overview

Elevate your telecom interface experience with the TL853CN by Texas Instruments. Crafted with precision and excellence, this cutting-edge technology offers unparalleled quality and reliability in telecommunications circuitry. Designed for seamless integration and optimal performance, this innovative product showcases the superior craftsmanship of a trusted industry leader. Elevate your communication systems to new heights with the TL853CN, delivering exceptional value and unmatched benefits for all your telecom interface needs. Trust Texas Instruments for top-notch solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for various telecom applications.

Power Supplies (V): 5

Operating at a standard 5V power supply makes the product compatible with most common power sources, ensuring ease of integration into different systems.

Package Style (Meter): IN-LINE

The in-line package style allows for easy installation and connection within existing telecom setups, making it convenient for deployment and maintenance.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even under demanding environmental conditions, increasing the product's resilience.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C enables the product to function effectively in a wide range of temperature settings, enhancing its versatility.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in connecting the product to different components, offering compatibility with various circuit designs.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures that the product meets industry standards and is suitable for use in commercial telecom applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the assembly process and enhances the product's mechanical stability, making it easier to integrate into circuit boards.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and functionality for telecommunication applications, ensuring reliable communication.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easier to incorporate the product into existing telecom systems.

Technical Specifications

Other Function Telecom Interface ICs TL853CN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP(UNSPEC)

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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