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TL851CD

Texas Instruments

TL851CD by Texas Instruments

TL851CD by Texas Instruments is a 16-terminal telecom interface IC with 5V power supply, operating b/w 0-40°C. It features a small outline package style, gull wing terminal form, and nickel palladium gold finish. Ideal for telecom circuits, it has a nominal voltage of 5V and max supply current of 0.26mA.

Median Price

$4.548

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 19 parts In-Stock

1+ parts

$0.433

100+ parts

-

1k+ parts

-

10k+ parts

-

19

$0.433

-

-

-

Rochester

USA . 4,625 parts In-Stock

1+ parts

$3.620

100+ parts

$3.550

1k+ parts

$3.480

10k+ parts

-

4,625

$3.620

$3.550

$3.480

-

Mouser Electronics

USA . 103 parts In-Stock

1+ parts

$10.360

100+ parts

$6.440

1k+ parts

$5.630

10k+ parts

-

103

$10.360

$6.440

$5.630

-

DigiKey

USA . 4,715 parts In-Stock

1+ parts

-

100+ parts

$6.260

1k+ parts

-

10k+ parts

-

4,715

-

$6.260

-

-

Verical

USA . 3,035 parts In-Stock

1+ parts

-

100+ parts

$5.475

1k+ parts

$4.900

10k+ parts

$4.612

3,035

-

$5.475

$4.900

$4.612

Chip1Stop

Japan . 360 parts In-Stock

1+ parts

-

100+ parts

$3.452

1k+ parts

-

10k+ parts

-

360

-

$3.452

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,412 parts In-Stock

1+ parts

$0.411

100+ parts

-

1k+ parts

-

10k+ parts

-

3,412

$0.411

-

-

-

Vyrian

USA . 3,744 parts In-Stock

1+ parts

$0.433

100+ parts

-

1k+ parts

-

10k+ parts

-

3,744

$0.433

-

-

-

Bristol Electronics

USA . 226 parts In-Stock

1+ parts

$5.600

100+ parts

$2.426

1k+ parts

$2.296

10k+ parts

-

226

$5.600

$2.426

$2.296

-

Flex Direct, LLC

USA . 226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

226

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,939 parts In-Stock

1+ parts

$0.390

100+ parts

-

1k+ parts

-

10k+ parts

-

2,939

$0.390

-

-

-

Parana Technologies

USA . 788 parts In-Stock

1+ parts

$11.311

100+ parts

-

1k+ parts

$11.744

10k+ parts

-

788

$11.311

-

$11.744

-

DigiPath Technology Company

USA . 1,054 parts In-Stock

1+ parts

$12.455

100+ parts

$11.458

1k+ parts

-

10k+ parts

-

1,054

$12.455

$11.458

-

-

ChromeModa Solutions

Germany . 2,453 parts In-Stock

1+ parts

$12.709

100+ parts

$10.421

1k+ parts

-

10k+ parts

-

2,453

$12.709

$10.421

-

-

IDEA Electronic Components Group

UK . 1,023 parts In-Stock

1+ parts

$12.709

100+ parts

$12.074

1k+ parts

$11.438

10k+ parts

-

1,023

$12.709

$12.074

$11.438

-

Assy Fe

Spain . 208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

208

-

-

-

-

Overview

Enhance your telecom systems with the TL851CD by Texas Instruments, a high-quality Other Function Telecom Interface IC. With a focus on innovation and reliability, Texas Instruments delivers superior products for a wide range of applications. The TL851CD offers customers value through its efficient performance and versatile capabilities, making it a valuable addition to any project. Upgrade your telecom systems today with the TL851CD and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, which is ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable makes installation and assembly of the product easier and more efficient, especially in automated production processes.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with common power sources and simplifies integration into existing systems.

No. of Terminals: 16

Having 16 terminals provides ample connections for various functions and features, allowing for versatile usage in telecom interface applications.

Maximum Operating Temperature: 40 °C

The high maximum operating temperature of 40°C ensures reliability and performance in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the product can withstand cold temperatures and function in diverse temperature settings.

Technology: BIPOLAR

Utilizing bipolar technology ensures efficient and accurate signal processing, making it suitable for telecom applications where reliability is crucial.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy soldering, enhancing the durability and reliability of the product in telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs TL851CD attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.26 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TL851CD Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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