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TL851CDR

Texas Instruments

TL851CDR by Texas Instruments

TL851CDR by Texas Instruments is a 16-terminal telecom IC with 5V supply voltage. It operates b/w 0-40°C, featuring GULL WING terminals and BIPOLAR technology. Ideal for telecom circuits, it has a small outline package style and is surface mountable.

Median Price

$5.606

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 117 parts In-Stock

1+ parts

$8.010

100+ parts

$5.770

1k+ parts

$5.170

10k+ parts

$4.940

117

$8.010

$5.770

$5.170

$4.940

Rochester

USA . 1,537 parts In-Stock

1+ parts

-

100+ parts

$4.370

1k+ parts

$3.910

10k+ parts

$3.680

1,537

-

$4.370

$3.910

$3.680

DigiKey

USA . 1,537 parts In-Stock

1+ parts

-

100+ parts

$5.750

1k+ parts

-

10k+ parts

-

1,537

-

$5.750

-

-

Verical

USA . 985 parts In-Stock

1+ parts

-

100+ parts

$5.463

1k+ parts

$4.888

10k+ parts

$4.600

985

-

$5.463

$4.888

$4.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,321 parts In-Stock

1+ parts

$3.848

100+ parts

-

1k+ parts

-

10k+ parts

-

3,321

$3.848

-

-

-

Vyrian

USA . 2,774 parts In-Stock

1+ parts

$4.050

100+ parts

-

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-

10k+ parts

-

2,774

$4.050

-

-

-

DigiKey Marketplace

USA . 1,537 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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1,537

-

-

-

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Chip Stock

USA . 455 parts In-Stock

1+ parts

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-

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455

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,269 parts In-Stock

1+ parts

$3.645

100+ parts

-

1k+ parts

-

10k+ parts

-

2,269

$3.645

-

-

-

Parana Technologies

USA . 1,726 parts In-Stock

1+ parts

$7.317

100+ parts

-

1k+ parts

$7.809

10k+ parts

-

1,726

$7.317

-

$7.809

-

DigiPath Technology Company

USA . 1,401 parts In-Stock

1+ parts

$8.057

100+ parts

$7.412

1k+ parts

-

10k+ parts

-

1,401

$8.057

$7.412

-

-

ChromeModa Solutions

Germany . 3,986 parts In-Stock

1+ parts

$8.221

100+ parts

$6.741

1k+ parts

-

10k+ parts

-

3,986

$8.221

$6.741

-

-

IDEA Electronic Components Group

UK . 749 parts In-Stock

1+ parts

$8.221

100+ parts

-

1k+ parts

$7.399

10k+ parts

-

749

$8.221

-

$7.399

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Kepictronics

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10,000

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

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4,000

-

-

-

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Perfect Parts

USA . 437 parts In-Stock

1+ parts

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100+ parts

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437

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Overview

Experience seamless communication with the TL851CDR by Texas Instruments, a top-quality telecom interface IC designed to enhance connectivity in various applications. Crafted by the trusted manufacturer, Texas Instruments, this innovative product offers unmatched reliability and performance. Whether you're in need of secure data transmission or efficient signal processing, the TL851CDR delivers exceptional value and benefits to customers. Upgrade your communication systems today with this cutting-edge solution and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount technology enables easy integration onto PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, allowing flexibility in power options for the device.

Bit Size: 8

8-bit architecture provides a good balance between performance and cost for many embedded applications.

ROM Words: 1024

Ample ROM capacity for storing program instructions and data, suitable for a variety of control tasks.

Maximum Clock Frequency: 20 MHz

High clock frequency allows for fast processing speeds, ideal for real-time applications and fast response times.

RAM Bytes: 64

Sufficient RAM capacity for temporary data storage and manipulation, enabling efficient operation of programs.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and integrated peripherals offer enhanced performance and functionality for diverse applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the device without the need for specialized equipment, facilitating updates and customization.

Technical Specifications

Other Function Telecom Interface ICs TL851CDR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.26 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TL851CDR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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