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TL852CNE4

Texas Instruments

TL852CNE4 by Texas Instruments

TL852CNE4 by Texas Instruments is a telecom interface IC with 16 terminals in an inline package. Operating temperature range of 0-40°C, suitable for commercial use. Features include nominal voltage of 5V, terminal pitch of 2.54mm, and technology type bipolar.

Median Price

$12.680

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 95 parts In-Stock

1+ parts

$12.680

100+ parts

$7.790

1k+ parts

$6.680

10k+ parts

-

95

$12.680

$7.790

$6.680

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,128 parts In-Stock

1+ parts

$10.412

100+ parts

-

1k+ parts

-

10k+ parts

-

2,128

$10.412

-

-

-

Vyrian

USA . 3,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,062

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,682 parts In-Stock

1+ parts

$9.864

100+ parts

-

1k+ parts

-

10k+ parts

-

1,682

$9.864

-

-

-

Parana Technologies

USA . 1,669 parts In-Stock

1+ parts

$11.347

100+ parts

-

1k+ parts

$11.774

10k+ parts

-

1,669

$11.347

-

$11.774

-

DigiPath Technology Company

USA . 2,271 parts In-Stock

1+ parts

$12.494

100+ parts

-

1k+ parts

-

10k+ parts

-

2,271

$12.494

-

-

-

ChromeModa Solutions

Germany . 4,706 parts In-Stock

1+ parts

$12.749

100+ parts

$10.454

1k+ parts

-

10k+ parts

-

4,706

$12.749

$10.454

-

-

IDEA Electronic Components Group

UK . 1,546 parts In-Stock

1+ parts

$12.749

100+ parts

$12.112

1k+ parts

$11.474

10k+ parts

-

1,546

$12.749

$12.112

$11.474

-

Overview

Experience unparalleled quality and innovation with the TL852CNE4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology in the form of this telecom interface IC. This versatile product is designed to meet a wide range of applications, providing customers with reliable performance and seamless operation. With its superior construction and advanced features, the TL852CNE4 offers exceptional value, convenience, and efficiency for all your telecom circuit needs. Choose Texas Instruments for excellence in telecommunications technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

No. of Terminals: 16

Having 16 terminals allows for versatile connectivity options and compatibility with a variety of systems.

Maximum Operating Temperature: 40 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliable performance in diverse settings.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and efficient power consumption.

Nominal Supply Voltage: 5 V

The 5V supply voltage is a common standard, compatible with many systems and applications.

Technical Specifications

Other Function Telecom Interface ICs TL852CNE4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TL852CNE4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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