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TL851CN

Texas Instruments

TL851CN by Texas Instruments

TL851CN by Texas Instruments is a 16-terminal telecom IC with a 5V supply voltage. It operates b/w 0-40°C, ideal for commercial applications. With a rectangular package style and through-hole terminal form, it's suitable for telecom circuit interfaces.

Median Price

$6.255

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 6 parts In-Stock

1+ parts

$4.097

100+ parts

-

1k+ parts

-

10k+ parts

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6

$4.097

-

-

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Chip1Stop

Japan . 6 parts In-Stock

1+ parts

$4.910

100+ parts

-

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-

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6

$4.910

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-

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Mouser Electronics

USA . 44 parts In-Stock

1+ parts

$9.970

100+ parts

$7.420

1k+ parts

$6.270

10k+ parts

-

44

$9.970

$7.420

$6.270

-

Rochester

USA . 1,120 parts In-Stock

1+ parts

-

100+ parts

$5.560

1k+ parts

$4.970

10k+ parts

$4.680

1,120

-

$5.560

$4.970

$4.680

DigiKey

USA . 1,120 parts In-Stock

1+ parts

-

100+ parts

$7.310

1k+ parts

-

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1,120

-

$7.310

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Verical

USA . 1,035 parts In-Stock

1+ parts

-

100+ parts

$6.950

1k+ parts

$6.213

10k+ parts

$5.850

1,035

-

$6.950

$6.213

$5.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,359 parts In-Stock

1+ parts

$2.961

100+ parts

-

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2,359

$2.961

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Vyrian

USA . 2,458 parts In-Stock

1+ parts

$3.117

100+ parts

-

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2,458

$3.117

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TEDSS.com

USA . 5 parts In-Stock

1+ parts

$5.000

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5

$5.000

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Component Electronics Inc.

Canada . 18 parts In-Stock

1+ parts

$7.690

100+ parts

$5.770

1k+ parts

$5.000

10k+ parts

-

18

$7.690

$5.770

$5.000

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Prism Electronics

USA . 767 parts In-Stock

1+ parts

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767

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Bristol Electronics

USA . 49 parts In-Stock

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49

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Electronic Expediters

USA . 39 parts In-Stock

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39

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PC Components Company LLC

USA . 23 parts In-Stock

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23

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Microfarads

USA . 5 parts In-Stock

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5

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Resion

USA . 5 parts In-Stock

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5

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GES GmbH

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,874 parts In-Stock

1+ parts

$2.805

100+ parts

-

1k+ parts

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10k+ parts

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4,874

$2.805

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-

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Parana Technologies

USA . 710 parts In-Stock

1+ parts

$14.422

100+ parts

-

1k+ parts

$14.865

10k+ parts

-

710

$14.422

-

$14.865

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DigiPath Technology Company

USA . 615 parts In-Stock

1+ parts

$15.880

100+ parts

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615

$15.880

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ChromeModa Solutions

Germany . 5,311 parts In-Stock

1+ parts

$16.204

100+ parts

$13.287

1k+ parts

-

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5,311

$16.204

$13.287

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IDEA Electronic Components Group

UK . 1,433 parts In-Stock

1+ parts

$16.204

100+ parts

$15.394

1k+ parts

$14.584

10k+ parts

-

1,433

$16.204

$15.394

$14.584

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A-Z Elektronik GmbH

Germany . 6,602 parts In-Stock

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6,602

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Perfect Parts

USA . 1,081 parts In-Stock

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1,081

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Overview

Upgrade your telecom systems with the TL851CN by Texas Instruments, a high-quality Telecom Interface IC that offers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this product is designed for various applications in the telecommunications industry. With its advanced technology and durable construction, the TL851CN provides customers with exceptional value, ensuring seamless communication and optimal functionality. Trust Texas Instruments for superior quality and experience the benefits of cutting-edge telecom solutions with the TL851CN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight, durable, and cost-effective, making it a good choice for telecom interface ICs that may be used in various applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into circuit designs and facilitates efficient PCB layout, making it a practical choice for telecom interface ICs.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for various input and output signals, making this product versatile for telecom applications.

Maximum Operating Temperature: 40 °C

With a high maximum operating temperature of 40°C, this IC can withstand elevated temperatures without compromising performance, ensuring reliability in different environments.

Nominal Supply Voltage: 5 V

Being designed for a nominal supply voltage of 5V, this IC is compatible with standard power sources, making it easy to integrate into existing systems.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and low power consumption, making it suitable for telecom applications that require fast data transmission and efficient power management.

Technical Specifications

Other Function Telecom Interface ICs TL851CN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TL851CN Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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