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TL16C752CIRHBRG4

Texas Instruments

TL16C752CIRHBRG4 by Texas Instruments

TL16C752CIRHBRG4 by Texas Instruments is a Serial Communication Controller with 5.5V max supply voltage, 0.375 MBps data transfer rate, and 48 MHz clock frequency. Ideal for industrial applications requiring high-speed asynchronous communication over 2 serial I/Os.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,990 parts In-Stock

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2,990

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Vyrian

USA . 2,104 parts In-Stock

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2,104

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Distributors (Availability)

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AZTECH Wire

Italy . 371 parts In-Stock

1+ parts

$6.117

100+ parts

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371

$6.117

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One Stop Electronics

USA . 1,444 parts In-Stock

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$14.000

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$14.000

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Parana Technologies

USA . 1,916 parts In-Stock

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$44.101

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1,916

$44.101

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DigiPath Technology Company

USA . 2,053 parts In-Stock

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$48.561

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$44.676

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2,053

$48.561

$44.676

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ChromeModa Solutions

Germany . 4,017 parts In-Stock

1+ parts

$49.552

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$40.633

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4,017

$49.552

$40.633

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IDEA Electronic Components Group

UK . 997 parts In-Stock

1+ parts

$49.552

100+ parts

$47.074

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$44.597

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997

$49.552

$47.074

$44.597

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Microchip USA

USA . 3,833 parts In-Stock

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Corphita

USA . 1,982 parts In-Stock

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Overview

Unlock seamless communication with the TL16C752CIRHBRG4 by Texas Instruments, a top-tier manufacturer known for reliability and innovation. This serial communication controller is versatile, offering high-speed data transfer rates and wide compatibility for various applications. Say goodbye to connectivity issues as this product ensures smooth and efficient communication processes. Trust in Texas Instruments to deliver quality and performance, setting the standard for excellence in the industry. Elevate your projects with the TL16C752CIRHBRG4 and experience unparalleled value and benefits that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and ensuring efficient assembly.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5V provides flexibility in power input options for various systems.

Address Bus Width: 3

A wider address bus width of 3 enhances data handling capabilities and supports efficient communication between components.

Power Supplies (V): 1.8/5

This dual power supply option (1.8V/5V) allows for compatibility with different voltage requirements in a system.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with other components and peripherals.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The use of chip carrier package style with heat sink/slug and very thin profile design contributes to efficient heat dissipation and space-saving in compact devices.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5V, the product ensures reliable operation even under lower voltage conditions.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85°C makes the product suitable for industrial environments with high temperature requirements.

Maximum Data Transfer Rate: 0.375 MBps

The high maximum data transfer rate of 0.375 MBps enables fast and efficient communication for enhanced productivity.

Minimum Operating Temperature: -40 °C

The product's capability to operate at temperatures as low as -40°C ensures reliable performance in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold offers excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections for optimal signal transmission.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm contributes to a compact and space-efficient design.

Width: 5 mm

The product's width of 5mm allows for easy integration into various electronic devices with limited space.

External Data Bus Width: 8

An external data bus width of 8 facilitates high-speed data transfer and efficient communication between devices.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol enhances compatibility and flexibility in data transmission methods.

Maximum Clock Frequency: 48 MHz

The high maximum clock frequency of 48 MHz allows for rapid data processing and efficient performance in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second time limit at peak reflow temperature ensures proper soldering and component reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and component adherence during assembly.

Length: 5 mm

The product's length of 5mm contributes to a compact form factor for easy integration into space-constrained designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable performance in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Being a serial IO/communication controller with a serial interface makes the product suitable for various communication applications.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, contributing to efficient and reliable operation.

Terminal Form: NO LEAD

The no-lead terminal form simplifies soldering processes and ensures better thermal management for improved performance.

Maximum Supply Current: 90 mA

With a maximum supply current of 90mA, the product offers efficient power consumption for extended operation.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, enhancing ease of integration into different systems.

No. of Serial I/Os: 2

Having 2 serial I/Os allows for versatile connectivity options and simultaneous communication with multiple devices.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting and compact PCB layouts, saving space and enhancing design flexibility.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that the product can withstand moderate exposure to moisture during handling and assembly processes.

Technical Specifications

Serial Communication Controllers TL16C752CIRHBRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8V/2.5V/3.3V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TL16C752CIRHBRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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