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TL16C752BPTRG4

Texas Instruments

TL16C752BPTRG4 by Texas Instruments

TL16C752BPTRG4 by Texas Instruments is a Serial Communication Controller with 3.6V max supply voltage, 0.375 MBps data transfer rate, and 48 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features 2 serial I/Os and operates in temperatures ranging from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 9,191 parts In-Stock

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Vyrian

USA . 7,379 parts In-Stock

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Digiode

USA . 2,448 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Connector Distribution Corp

USA . 13 parts In-Stock

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Right Parts Inc.

USA . 13 parts In-Stock

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One Stop Electronics

USA . 525 parts In-Stock

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$14.000

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$14.000

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AZTECH Wire

Italy . 448 parts In-Stock

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$15.440

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$15.440

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Ampacity Inc.

Singapore . 1,144 parts In-Stock

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$27.000

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$60.205

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$54.787

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$49.368

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Parana Technologies

USA . 2,343 parts In-Stock

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$72.929

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$6,772.589

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$65.636

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DigiPath Technology Company

USA . 625 parts In-Stock

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$80.304

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$73.880

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ChromeModa Solutions

Germany . 5,540 parts In-Stock

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IDEA Electronic Components Group

UK . 319 parts In-Stock

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$81.943

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$77.846

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$73.749

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319

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Bastille Electronics

Australia . 300 parts In-Stock

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Corphita

USA . 210 parts In-Stock

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Microchip USA

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FE SAS

France . 92 parts In-Stock

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Overview

Enhance your communication systems with the TL16C752BPTRG4 by Texas Instruments. This high-quality Serial Communication Controller offers reliable and efficient data transfer at a maximum rate of 0.375 MBps, making it ideal for industrial applications. With a low power mode and a wide temperature range, this product provides unmatched value and performance. Trust in Texas Instruments' reputation for excellence and choose the TL16C752BPTRG4 for all your serial communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where portability is important.

Surface Mount: YES

This surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it versatile for different power requirements.

Address Bus Width: 3

The address bus width of 3 enhances the efficiency and speed of data communication, making this product suitable for high-performance systems.

Package Shape: SQUARE

The square package shape maximizes space utilization on the circuit board, making it a compact and efficient choice for tight spaces.

Power Supplies (V): 3.3

The 3.3V power supply ensures stable and reliable operation, making this product a dependable choice for long-term use.

No. of Terminals: 48

With 48 terminals, this product offers ample connectivity options for various components, enhancing its versatility in system integration.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style optimizes the product's footprint on the circuit board, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage allows for energy-efficient operation, making this product a cost-effective choice for power-conscious projects.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions, making this product suitable for industrial applications.

Maximum Data Transfer Rate: 0.375 MBps

The high data transfer rate of 0.375 MBps enables fast and efficient communication, making this product ideal for high-speed data processing tasks.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product can withstand extreme cold conditions, making it a reliable choice for outdoor or refrigerated environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance, extending the product's lifespan and reliability.

Terminal Position: QUAD

The quad terminal position offers secure connection points for components, minimizing the risk of signal interference and ensuring stable operation.

Maximum Seated Height: 1.6 mm

The low maximum seated height helps reduce the overall profile of the product on the circuit board, making it suitable for compact designs.

Technical Specifications

Serial Communication Controllers TL16C752BPTRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TL16C752BPTRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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