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TL16C554AFNRG4

Texas Instruments

TL16C554AFNRG4 by Texas Instruments

TL16C554AFNRG4 by Texas Instruments is a Serial Communication Controller with 3.6V max supply voltage, 16MHz clock frequency, and 0.125 MBps data transfer rate. Ideal for applications requiring high-speed asynchronous communication in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,630 parts In-Stock

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3,630

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Digiode

USA . 1,267 parts In-Stock

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1,267

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Chip Stock

USA . 375 parts In-Stock

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375

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Euro-Tech

UK . 273 parts In-Stock

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273

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LIBRA Elektronik GmbH

Germany . 24 parts In-Stock

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24

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Distributors (Availability)

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AZTECH Wire

Italy . 508 parts In-Stock

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$4.933

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508

$4.933

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One Stop Electronics

USA . 633 parts In-Stock

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$19.000

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633

$19.000

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Parana Technologies

USA . 1,630 parts In-Stock

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$33.633

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$130.091

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$33.633

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$130.091

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DigiPath Technology Company

USA . 1,912 parts In-Stock

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$37.034

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$37.034

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ChromeModa Solutions

Germany . 3,471 parts In-Stock

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$37.790

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$30.988

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$37.790

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IDEA Electronic Components Group

UK . 961 parts In-Stock

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$37.790

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$35.900

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$34.011

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961

$37.790

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$34.011

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Corphita

USA . 4,785 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Unlock seamless communication with the TL16C554AFNRG4 by Texas Instruments. Manufactured with top-notch quality, this Serial Communication Controller offers unparalleled reliability and performance for a wide range of applications. From industrial automation to telecommunications, this chip carrier package delivers high-speed data transfer rates and efficient serial I/O capabilities. Say goodbye to communication barriers and hello to streamlined operations with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and providing a reliable connection.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources, making it versatile for different design requirements.

Address Bus Width: 3

With an address bus width of 3, the controller can handle a range of memory address locations efficiently, enhancing its processing capabilities.

Package Shape: SQUARE

The square package shape allows for easy placement and alignment on the circuit board, optimizing space utilization.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V power supplies offers flexibility in voltage selection, catering to different system requirements.

No. of Terminals: 68

Having 68 terminals provides ample connectivity options for interfacing with other components, enabling versatile communication capabilities.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a compact and efficient form factor, making it ideal for space-constrained designs.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V ensures proper operation even under low voltage conditions, improving reliability.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the controller to perform reliably in various environmental conditions.

Maximum Data Transfer Rate: 0.125 MBps

With a maximum data transfer rate of 0.125 MBps, the controller can efficiently handle data transmission, ensuring smooth communication.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures functionality in colder environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and conductivity, enhancing the longevity and performance of the product.

Terminal Position: QUAD

The quad terminal position allows for stable and reliable connections with other components, ensuring secure data transmission.

Maximum Seated Height: 4.57 mm

The maximum seated height of 4.57mm is compact, facilitating installation in compact spaces and reducing overall board height.

Width: 24.23 mm

A width of 24.23mm offers a balance between compact size and efficient layout, making it suitable for integration into various systems.

Data Encoding or Decoding Method: NRZ

The NRZ data encoding/decoding method ensures reliable and accurate data transmission, minimizing errors and improving communication integrity.

External Data Bus Width: 8

An external data bus width of 8 allows for efficient data transfer between the controller and external devices, enhancing data processing capabilities.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level protocols makes the controller compatible with a wide range of devices and systems.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16MHz enables high-speed data processing, making the controller suitable for applications requiring quick data transmission.

Maximum Time At Peak Reflow Temperature (s): 30

The controller can handle peak reflow temperatures for up to 30 seconds, ensuring proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the controller can withstand high-temperature soldering processes without compromising performance.

Length: 24.23 mm

A length of 24.23mm provides a balanced form factor, enabling easy integration into various electronic designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions, making it suitable for commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

As a serial IO/communication controller, this product offers versatile connectivity options for serial communication, making it ideal for a wide range of applications.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the controller.

Terminal Form: J BEND

The J bend terminal form allows for easy and secure soldering, ensuring stable connections for data transmission.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures consistent and stable operation, meeting the power requirements of the controller.

No. of Serial I/Os: 4

Having 4 serial I/Os allows for multiple data input/output connections, enabling the controller to communicate with multiple devices simultaneously.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27mm enables easy PCB layout and assembly, facilitating efficient integration into electronic systems.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the controller can withstand moderate exposure to moisture during storage and assembly, ensuring long-term reliability.

Technical Specifications

Serial Communication Controllers TL16C554AFNRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5 V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C554AFNRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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