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TL16C552AIFNG4

Texas Instruments

TL16C552AIFNG4 by Texas Instruments

TL16C552AIFNG4 by Texas Instruments is a Serial Communication Controller with 5V supply, 16MHz clock frequency, and 0.125 MBps data transfer rate. Ideal for industrial applications requiring asynchronous communication protocol and 8-bit external data bus width.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,229 parts In-Stock

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4,229

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Digiode

USA . 1,487 parts In-Stock

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1,487

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Distributors (Availability)

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One Stop Electronics

USA . 1,062 parts In-Stock

1+ parts

$1.000

100+ parts

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1,062

$1.000

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AZTECH Wire

Italy . 369 parts In-Stock

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$16.730

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369

$16.730

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Parana Technologies

USA . 1,042 parts In-Stock

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$28.390

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$46.927

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1,042

$28.390

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$46.927

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DigiPath Technology Company

USA . 1,358 parts In-Stock

1+ parts

$31.261

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$28.760

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1,358

$31.261

$28.760

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IDEA Electronic Components Group

UK . 536 parts In-Stock

1+ parts

$31.899

100+ parts

$30.304

1k+ parts

$28.709

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536

$31.899

$30.304

$28.709

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ChromeModa Solutions

Germany . 435 parts In-Stock

1+ parts

$31.899

100+ parts

$26.157

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435

$31.899

$26.157

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Corphita

USA . 3,592 parts In-Stock

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3,592

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Microchip USA

USA . 316 parts In-Stock

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Overview

Enhance your communication systems with the TL16C552AIFNG4 by Texas Instruments, a premium Serial Communication Controller that guarantees reliability and efficiency. Manufactured by industry leader Texas Instruments, this product ensures high-quality performance for a wide range of applications. With its advanced technology and cutting-edge design, this controller offers unmatched value, benefits, and advantages to customers looking to optimize their serial communication systems. Upgrade your communication setup today with the TL16C552AIFNG4 and experience seamless data transfer at its best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mount compatible, the product can be easily integrated onto circuit boards, saving space and enabling efficient assembly processes.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage tolerance, the product offers a wide operating range and can withstand voltage fluctuations without damage.

Address Bus Width: 3

The 3-bit address bus width allows for multiple devices to be connected within the same system, enabling efficient communication and data transfer.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it easier to incorporate the product into space-constrained designs.

Power Supplies (V): 5

Operating at a standard voltage of 5V, the product is compatible with a wide range of systems and power sources, enhancing versatility.

No. of Terminals: 68

With 68 terminals, the product offers ample connectivity options for interfacing with other components and peripherals, ensuring comprehensive functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a secure and reliable enclosure for the components, safeguarding them against external factors and mechanical stress.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement ensures efficient power consumption and operation at lower voltage levels, optimizing energy efficiency.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, the product is suitable for industrial environments and applications where heat resistance is essential.

Maximum Data Transfer Rate: 0.125 MBps

With a maximum data transfer rate of 0.125 MBps, the product offers fast and reliable communication capabilities, ensuring efficient data exchange.

Minimum Operating Temperature: -40 °C

Designed to withstand extremely low temperatures down to -40°C, the product is ideal for use in cold environments or applications requiring temperature resilience.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides enhanced conductivity and corrosion resistance, ensuring long-lasting performance and reliability.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, reducing the risk of signal interference or disconnection during operation.

Maximum Seated Height: 4.57 mm

With a low maximum seated height of 4.57mm, the product is compact and space-saving, ideal for applications with height constraints or limited clearance.

Width: 24.23 mm

The 24.23mm width of the product offers a balanced form factor, facilitating easy integration into standard PCB layouts and designs.

External Data Bus Width: 8

The 8-bit external data bus width allows for high-speed data transfer and processing, enhancing overall system performance and efficiency.

Communication Protocol: ASYNC, BIT

Supporting asynchronous communication and bit-wise data transmission, the product offers flexible and versatile communication options for different applications.

Maximum Clock Frequency: 16 MHz

Featuring a high maximum clock frequency of 16 MHz, the product enables fast data processing and communication, improving overall system speed and performance.

Maximum Time At Peak Reflow Temperature (s): 30

The product can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering and assembly processes without compromising performance.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperatures of 260°C, the product is suitable for lead-free soldering techniques, ensuring compliance with industry standards.

Length: 24.23 mm

The 24.23mm length of the product offers a compact footprint, allowing for easy installation and integration into various electronic devices and systems.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade performance, the product is reliable and durable in harsh environments, making it suitable for demanding industrial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

As a serial I/O communication controller, the product facilitates serial communication and data transfer, enabling seamless connectivity between different devices and systems.

Technology: CMOS

Utilizing CMOS technology, the product offers low power consumption, high noise immunity, and reliable operation, making it an energy-efficient and robust solution.

Terminal Form: J BEND

The J bend terminal form provides secure soldering connections and electrical contact, ensuring stable and reliable performance in various operating conditions.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, the product is compatible with standard power sources and systems, simplifying integration and deployment.

No. of Serial I/Os: 2

Featuring 2 serial I/O channels, the product offers multiple communication interfaces for data exchange and control signals, enhancing connectivity and versatility.

Bus Compatibility: IBM PC-AT

Compatible with IBM PC-AT bus systems, the product can be easily integrated into existing computer architectures, ensuring seamless interoperability and performance.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the product offers precise and secure connections, reducing the risk of signal interference or short circuits during operation.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product is suitable for standard surface mount assembly processes, providing enhanced reliability and performance.

Technical Specifications

Serial Communication Controllers TL16C552AIFNG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ENHANCED BIDIRECTIONAL PRINTER PORT

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

IBM PC-AT

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C552AIFNG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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