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TL16C552AIFN

Texas Instruments

TL16C552AIFN by Texas Instruments

TL16C552AIFN by Texas Instruments is a Serial Communication Controller with 5V power supply, 16MHz clock frequency, and 0.125 MBps data transfer rate. It is ideal for industrial applications requiring asynchronous communication protocol and 2 serial I/Os, compatible with IBM PC-AT bus.

Median Price

$5.944

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 29 parts In-Stock

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$5.388

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Chip1Stop

Japan . 44 parts In-Stock

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$6.500

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Verical

USA . 44 parts In-Stock

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Digiode

USA . 409 parts In-Stock

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$5.119

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Bristol Electronics

USA . 70 parts In-Stock

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$10.870

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$4.710

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Vyrian

USA . 2,208 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 70 parts In-Stock

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Dan-Mar Components

USA . 70 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 56 parts In-Stock

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ECAB

Sweden . 54 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 36 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,097 parts In-Stock

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$4.849

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$4.849

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AZTECH Wire

Italy . 359 parts In-Stock

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$17.670

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359

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Microchip USA

USA . 9,301 parts In-Stock

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$26.910

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$26.520

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$26.330

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$26.140

9,301

$26.910

$26.520

$26.330

$26.140

Parana Technologies

USA . 1,148 parts In-Stock

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$74.045

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DigiPath Technology Company

USA . 1,363 parts In-Stock

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$81.533

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ChromeModa Solutions

Germany . 1,511 parts In-Stock

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$83.197

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$68.222

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1,511

$83.197

$68.222

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IDEA Electronic Components Group

UK . 780 parts In-Stock

1+ parts

$83.197

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$79.037

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$74.877

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780

$83.197

$79.037

$74.877

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QUARKTWIN TECHNOLOGY LTD

USA . 17,204 parts In-Stock

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Lixinc

USA . 9,054 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,412 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Perfect Parts

USA . 310 parts In-Stock

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Overview

Enhance your communication systems with the TL16C552AIFN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Serial Communication Controllers that offer unparalleled reliability and performance. This versatile chip carrier is perfect for various applications, providing seamless data transfer at a maximum rate of 0.125 MBps. With a wide operating temperature range and compatibility with IBM PC-AT, this industrial-grade solution ensures smooth and efficient serial communication. Trust Texas Instruments to elevate your technology with cutting-edge solutions that bring value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, perfect for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance allows for reliable operation even in environments with voltage fluctuations.

Address Bus Width: 3

The 3-bit address bus width provides flexibility in interfacing with other components in the system.

Package Shape: SQUARE

The square package shape is compact and space-saving, ideal for densely populated PCB designs.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard voltage levels in most electronic systems.

No. of Terminals: 68

With 68 terminals, this controller offers a wide range of connectivity options for various peripherals and devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides better thermal performance and signal integrity compared to other package styles.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement allows for operation in low-power environments without compromising performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures the controller can withstand harsh environmental conditions without overheating.

Maximum Data Transfer Rate: 0.125 MBps

The high data transfer rate of 0.125 MBps enables fast and efficient communication between devices.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range allows the controller to function reliably in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position simplifies PCB layout and assembly, making installation more efficient.

Maximum Seated Height: 4.57 mm

The low seated height minimizes the overall height of the controller on the PCB, saving space in compact designs.

Width: 24.23 mm

The moderate width of 24.23 mm strikes a balance between space-saving and ease of handling during assembly.

External Data Bus Width: 8

The wide external data bus width of 8 bits allows for high-speed data transmission between the controller and peripherals.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-wise data transfer enables versatile connectivity options in various system configurations.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency of 16 MHz ensures smooth and seamless operation of the controller in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The controller can withstand peak reflow temperatures for up to 30 seconds, making it suitable for soldering processes in manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and reliability of the controller in harsh assembly conditions.

Length: 24.23 mm

The length of 24.23 mm complements the width, providing a compact form factor for integration into various electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in rugged industrial environments with wide temperature variations.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The controller's peripheral IC type and serial communication capabilities make it suitable for a wide range of serial interface applications.

Technology: CMOS

The advanced CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the controller.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process during assembly and ensures secure connections for reliable performance.

Maximum Supply Current: 50 mA

The low maximum supply current requirement of 50 mA contributes to energy efficiency and extends the battery life of portable devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, simplifying integration into existing systems.

No. of Serial I/Os: 2

The two serial I/O ports provide flexibility for connecting multiple serial devices simultaneously, enhancing the controller's versatility.

Bus Compatibility: IBM PC-AT

Compatibility with the IBM PC-AT bus standard ensures seamless integration and interoperability with a wide range of computer systems and peripherals.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density mounting on PCBs, optimizing space utilization in compact designs.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates that the controller has a moderate level of moisture sensitivity, making it suitable for standard manufacturing and storage conditions.

Technical Specifications

Serial Communication Controllers TL16C552AIFN attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ENHANCED BIDIRECTIONAL PRINTER PORT

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

IBM PC-AT

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C552AIFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-614-7872, 5962016147872

NIIN

016147872

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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