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TISPL758LF3D

Texas Instruments

TISPL758LF3D by Texas Instruments

TISPL758LF3D by Texas Instruments is a Silicon Surge Protector with 20A peak current, 130V min breakdown voltage, and 180V max DC off-state voltage. It is ideal for surge protection applications in electronics due to its series connected configuration and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,489 parts In-Stock

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5,489

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Legend Electronics Inc.

USA . 2,380 parts In-Stock

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2,380

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Digiode

USA . 735 parts In-Stock

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735

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,273 parts In-Stock

1+ parts

$1.895

100+ parts

-

1k+ parts

$2.434

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2,273

$1.895

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$2.434

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DigiPath Technology Company

USA . 2,226 parts In-Stock

1+ parts

$2.086

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2,226

$2.086

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ChromeModa Solutions

Germany . 2,911 parts In-Stock

1+ parts

$2.129

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$1.746

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2,911

$2.129

$1.746

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IDEA Electronic Components Group

UK . 550 parts In-Stock

1+ parts

$2.129

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$1.916

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550

$2.129

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$1.916

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One Stop Electronics

USA . 1,208 parts In-Stock

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$12.100

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1,208

$12.100

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AZTECH Wire

Italy . 739 parts In-Stock

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$19.172

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739

$19.172

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Corphita

USA . 4,215 parts In-Stock

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4,215

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Overview

Protect your valuable electronic devices with the TISPL758LF3D by Texas Instruments, a top-quality silicon surge protector designed to safeguard against power surges and voltage spikes. Manufactured by industry leader Texas Instruments, this series-connected, center-tap surge protector offers reliable protection with its 20A non-repetitive peak on-state current and minimum breakdown voltage of 130V. Ideal for a range of applications, including consumer electronics and industrial equipment, this product's small outline package and gull wing terminal form make it easy to integrate into your design. Trust Texas Instruments to deliver superior quality and performance in every product they manufacture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection against external factors, making this surge protector reliable for long-term use.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

The series connected configuration with 2 elements and center tap design enhances the overall performance and efficiency of the surge protector, providing better protection against surges.

Non Repetitive Peak On-state Current: 20 A

The high non repetitive peak on-state current capability of 20 A ensures effective handling of surges and transient events, safeguarding connected devices.

Surface Mount: YES

With surface mount capability, this surge protector can be easily integrated into various electronic devices, offering convenient installation and space-saving benefits.

Minimum Breakdown Voltage: 130 V

The minimum breakdown voltage of 130 V ensures that the surge protector activates promptly upon detecting a surge, providing quick and efficient protection to the connected equipment.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact and space-efficient design, making it suitable for integration in a wide range of electronic applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable performance of the surge protector in high voltage environments.

Maximum DC Off-state Voltage: 180 V

The maximum DC off-state voltage rating of 180 V enhances the surge protector's ability to withstand voltage variations, ensuring continuous protection for electronic devices.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this surge protector can withstand high temperatures without compromising its performance, making it suitable for various applications.

Trigger Device Type: SILICON SURGE PROTECTOR

The silicon surge protector technology ensures reliable surge protection and fast response times, safeguarding connected devices against voltage spikes and surges.

Minimum Operating Temperature: -40 °C

The surge protector's minimum operating temperature of -40°C allows it to function effectively in extreme cold conditions, ensuring continuous protection for devices in harsh environments.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connectivity options, allowing for easy integration of the surge protector into various electronic devices and systems.

Maximum Breakdown Voltage: 220 V

The maximum breakdown voltage of 220 V ensures that the surge protector can effectively handle high voltage surges, providing robust protection for sensitive electronic equipment.

Technical Specifications

Silicon Surge Protectors TISPL758LF3D attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

220 V

Minimum Breakdown Voltage:

130 V

Maximum DC Off-state Voltage:

180 V

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

20 A

No. of Elements:

2

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISPL758LF3D Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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