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TISP2240F3SL

Texas Instruments

TISP2240F3SL by Texas Instruments

TISP2240F3SL by Texas Instruments is a 3-element silicon surge protector with 6A peak current and 240V breakdown voltage. It is designed for surge protection applications, featuring a plastic/epoxy body, delta connected configuration, and UL recognized reference standard.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,972 parts In-Stock

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2,972

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Digiode

USA . 2,460 parts In-Stock

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2,460

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,022 parts In-Stock

1+ parts

$3.187

100+ parts

-

1k+ parts

$3.709

10k+ parts

-

1,022

$3.187

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$3.709

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ChromeModa Solutions

Germany . 5,616 parts In-Stock

1+ parts

$3.581

100+ parts

$2.936

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-

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5,616

$3.581

$2.936

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IDEA Electronic Components Group

UK . 198 parts In-Stock

1+ parts

$3.581

100+ parts

-

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$3.223

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198

$3.581

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$3.223

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One Stop Electronics

USA . 1,349 parts In-Stock

1+ parts

$15.100

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1,349

$15.100

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Semicontronic

India . 912 parts In-Stock

1+ parts

$17.100

100+ parts

$16.672

1k+ parts

$16.587

10k+ parts

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912

$17.100

$16.672

$16.587

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AZTECH Wire

Italy . 248 parts In-Stock

1+ parts

$17.871

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248

$17.871

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Corphita

USA . 1,743 parts In-Stock

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1,743

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DigiPath Technology Company

USA . 411 parts In-Stock

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100+ parts

$3.229

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411

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$3.229

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Corohmni

South Africa . 341 parts In-Stock

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341

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Overview

Upgrade your surge protection with the TISP2240F3SL by Texas Instruments. Made with high-quality materials and advanced technology, this silicon surge protector offers unparalleled reliability and performance. Ideal for a wide range of applications, this product provides peace of mind by safeguarding your electronics from power surges and voltage spikes. Trust in Texas Instruments' reputation for excellence and choose the TISP2240F3SL for superior protection and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to harsh environments, making this surge protector suitable for various applications.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements ensures efficient surge protection and distribution of current, ensuring reliable performance.

Non Repetitive Peak On-state Current: 6 A

With a peak on-state current of 6A, this surge protector can effectively handle high levels of current during transient events, protecting connected devices.

Package Shape: RECTANGULAR

The rectangular shape allows for easy installation and space-saving design, making it convenient for various mounting options.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and ease of installation, ensuring a reliable electrical connection.

Maximum DC Off-state Voltage: 180 V

The maximum DC off-state voltage of 180V ensures protection against high voltage surges, safeguarding connected equipment.

Trigger Device Type: SILICON SURGE PROTECTOR

The silicon surge protector offers fast response times and high surge handling capacity, providing superior protection against voltage spikes and surges.

Maximum Breakdown Voltage: 240 V

The maximum breakdown voltage of 240V ensures that the surge protector can handle high voltage levels before conducting current, protecting devices effectively.

Reference Standard: UL RECOGNIZED

The UL recognized certification indicates that this surge protector meets industry safety and performance standards, ensuring reliability and peace of mind.

Technical Specifications

Silicon Surge Protectors TISP2240F3SL attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

240 V

Maximum DC Off-state Voltage:

180 V

JESD-30 Code:

R-PSIP-T3

Non Repetitive Peak On-state Current:

6 A

No. of Elements:

3

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP2240F3SL Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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