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TISP3125H3SL

Texas Instruments

TISP3125H3SL by Texas Instruments

TISP3125H3SL by Texas Instruments is a Silicon Surge Protector with 60A peak current, 100V off-state voltage, and 125V breakdown voltage. It is used for surge protection in various applications due to its thyristor trigger device type and series-connected configuration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,062 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,062

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Digiode

USA . 4,488 parts In-Stock

1+ parts

-

100+ parts

-

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4,488

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Cyclops Electronics Ltd

UK . 1,000 parts In-Stock

1+ parts

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1,000

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 200 parts In-Stock

1+ parts

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 336 parts In-Stock

1+ parts

$3.542

100+ parts

-

1k+ parts

$4.065

10k+ parts

-

336

$3.542

-

$4.065

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DigiPath Technology Company

USA . 1,229 parts In-Stock

1+ parts

$3.900

100+ parts

-

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-

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1,229

$3.900

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ChromeModa Solutions

Germany . 4,395 parts In-Stock

1+ parts

$3.980

100+ parts

$3.264

1k+ parts

-

10k+ parts

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4,395

$3.980

$3.264

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IDEA Electronic Components Group

UK . 2,194 parts In-Stock

1+ parts

$3.980

100+ parts

-

1k+ parts

$3.582

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2,194

$3.980

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$3.582

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One Stop Electronics

USA . 1,318 parts In-Stock

1+ parts

$6.100

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1,318

$6.100

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AZTECH Wire

Italy . 375 parts In-Stock

1+ parts

$16.914

100+ parts

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375

$16.914

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Corphita

USA . 3,986 parts In-Stock

1+ parts

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3,986

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Overview

Protect your valuable electronic devices with the TISP3125H3SL by Texas Instruments. Manufactured by a trusted industry leader, this silicon surge protector offers reliable protection against voltage spikes and surges. Perfect for a wide range of applications, this series connected, center tap device features 2 elements and a maximum breakdown voltage of 125V, ensuring the safety of your equipment. With a compact rectangular package style and easy through-hole terminal form, the TISP3125H3SL provides peace of mind at an affordable price. Say goodbye to worries about power fluctuations and safeguard your investments with this high-quality surge protector.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good insulation and protection against external elements, making the surge protector durable and long-lasting.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

The series connected configuration with center tap and 2 elements ensures effective surge protection and distribution of current, enhancing the overall performance of the surge protector.

Non Repetitive Peak On-state Current: 60 A

With a high non repetitive peak on-state current rating of 60 A, this surge protector can effectively handle sudden spikes in current flow, safeguarding connected devices from potential damage.

Maximum Operating Temperature: 150 °C

The surge protector has a high maximum operating temperature of 150°C, allowing it to withstand elevated temperature environments without compromising its functionality.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The use of thyristor surge protector as the trigger device ensures rapid response to electrical surges, offering reliable protection to connected equipment.

Technical Specifications

Silicon Surge Protectors TISP3125H3SL attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

125 V

Maximum DC Off-state Voltage:

100 V

Maximum Holding Current:

600 mA

JESD-30 Code:

R-PSIP-T3

Non Repetitive Peak On-state Current:

60 A

No. of Elements:

2

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP3125H3SL Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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