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TISP4395M3LM

Texas Instruments

TISP4395M3LM by Texas Instruments

TISP4395M3LM by Texas Instruments is a single silicon surge protector with 32A peak current. It operates b/w -40°C to 150°C, has 395V breakdown voltage, and UL recognized. Ideal for protecting electronic devices from power surges in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,535 parts In-Stock

1+ parts

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4,535

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Digiode

USA . 2,218 parts In-Stock

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2,218

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Legend Electronics Inc.

USA . 1,936 parts In-Stock

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1,936

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 903 parts In-Stock

1+ parts

$2.100

100+ parts

-

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903

$2.100

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Parana Technologies

USA . 1,199 parts In-Stock

1+ parts

$4.252

100+ parts

$394.902

1k+ parts

$3.827

10k+ parts

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1,199

$4.252

$394.902

$3.827

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DigiPath Technology Company

USA . 1,273 parts In-Stock

1+ parts

$4.682

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1,273

$4.682

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IDEA Electronic Components Group

UK . 817 parts In-Stock

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$4.778

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$4.300

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817

$4.778

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$4.300

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ChromeModa Solutions

Germany . 75 parts In-Stock

1+ parts

$4.778

100+ parts

$3.918

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75

$4.778

$3.918

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AZTECH Wire

Italy . 423 parts In-Stock

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$11.667

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423

$11.667

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Corphita

USA . 4,197 parts In-Stock

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4,197

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Overview

When it comes to protecting your valuable electronics from power surges, trust the TISP4395M3LM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The TISP4395M3LM is a silicon surge protector designed for applications where robust protection is essential. Its single configuration and high performance make it ideal for a wide range of electronic devices. With a maximum breakdown voltage of 395V and UL recognition, this surge protector offers peace of mind and superior protection for your equipment. Upgrade to the TISP4395M3LM today and safeguard your investments with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material provides good protection against external elements, ensuring long-lasting performance.

Configuration: SINGLE

Single configuration is simple and easy to install, making it convenient for users.

Non Repetitive Peak On-state Current: 32 A

High peak on-state current capacity allows for effective protection against sudden surges in power.

Package Shape: ROUND

Round shape is compact and space-saving, ideal for embedding in electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enables secure connection and stability during operation.

No. of Terminals: 2

Having 2 terminals simplifies the wiring process and reduces chances of errors during installation.

Package Style (Meter): CYLINDRICAL

Cylindrical package style makes it easy to fit into various devices and equipment efficiently.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliable performance even in demanding environments.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

Thyristor surge protector offers quick response and effective protection against power surges.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of temperature conditions.

Terminal Position: BOTTOM

Bottom terminal position makes it easy to connect and integrate into existing systems.

Maximum Holding Current: 600 mA

High maximum holding current capability ensures continuous protection against surge events.

Maximum Breakdown Voltage: 395 V

High maximum breakdown voltage offers superior protection against high voltage spikes.

Reference Standard: UL RECOGNIZED

UL recognized standard ensures the product meets safety and performance requirements.

Technical Specifications

Silicon Surge Protectors TISP4395M3LM attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

395 V

Configuration:

Maximum Holding Current:

600 mA

JESD-30 Code:

O-PBCY-T2

Non Repetitive Peak On-state Current:

32 A

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP4395M3LM Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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