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TISP7125F3DR

Texas Instruments

TISP7125F3DR by Texas Instruments

TISP7125F3DR by Texas Instruments is a silicon surge protector with 3 delta-connected elements. It has a non-repetitive peak on-state current of 4.3A and max breakdown voltage of 125V. Ideal for protecting electronic circuits from voltage surges in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,351 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,351

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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2,500

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Digiode

USA . 1,532 parts In-Stock

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1,532

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 665 parts In-Stock

1+ parts

$4.168

100+ parts

-

1k+ parts

$4.611

10k+ parts

-

665

$4.168

-

$4.611

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DigiPath Technology Company

USA . 233 parts In-Stock

1+ parts

$4.589

100+ parts

$4.222

1k+ parts

-

10k+ parts

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233

$4.589

$4.222

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ChromeModa Solutions

Germany . 5,412 parts In-Stock

1+ parts

$4.683

100+ parts

$3.840

1k+ parts

-

10k+ parts

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5,412

$4.683

$3.840

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IDEA Electronic Components Group

UK . 758 parts In-Stock

1+ parts

$4.683

100+ parts

-

1k+ parts

$4.215

10k+ parts

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758

$4.683

-

$4.215

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AZTECH Wire

Italy . 873 parts In-Stock

1+ parts

$15.000

100+ parts

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873

$15.000

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One Stop Electronics

USA . 1,316 parts In-Stock

1+ parts

$17.100

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1,316

$17.100

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Component Stockers USA

USA . 228 parts In-Stock

1+ parts

$99.990

100+ parts

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228

$99.990

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Corphita

USA . 2,926 parts In-Stock

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2,926

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Overview

Enhance the protection of your electronic devices with the TISP7125F3DR by Texas Instruments. Manufactured by the reputable brand, this Silicon Surge Protector offers superior quality and reliability. Ideal for a wide range of applications, this product provides peace of mind by safeguarding against voltage spikes and surges. With its advanced technology and durable construction, customers can trust in the value and benefits that this surge protector brings to their equipment. Upgrade to the TISP7125F3DR and experience enhanced safety for your valuable devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the surge protector, making it a reliable choice for long-term use.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements ensures efficient distribution of surge protection, enhancing the overall performance of the product.

Non Repetitive Peak On-state Current: 4.3 A

With a high non-repetitive peak on-state current of 4.3 A, this surge protector can effectively handle sudden surges in power, safeguarding connected devices.

Surface Mount: YES

Being surface mountable allows for easy installation and integration of the surge protector into various electronic setups, saving time and effort.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, making it space-efficient and suitable for installations where space is limited.

Maximum DC Off-state Voltage: 100 V

The high maximum DC off-state voltage rating of 100 V ensures protection against voltage spikes and surges, enhancing the safety of connected equipment.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

Utilizing a thyristor surge protector as the trigger device ensures quick and effective response to sudden voltage fluctuations, providing reliable protection to electronic devices.

Technical Specifications

Silicon Surge Protectors TISP7125F3DR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

125 V

Maximum DC Off-state Voltage:

100 V

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

Non Repetitive Peak On-state Current:

4.3 A

No. of Elements:

3

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Silicon Surge Protectors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP7125F3DR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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