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TISP3260F3P

Texas Instruments

TISP3260F3P by Texas Instruments

TISP3260F3P by Texas Instruments is a Silicon Surge Protector with 6A Non Repetitive Peak On-state Current and 200V Max DC Off-state Voltage. It features SERIES CONNECTED, CENTER TAP configuration for surge protection applications. The device has 2 elements in RECTANGULAR package style suitable for UL RECOGNIZED standards.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,844 parts In-Stock

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7,844

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Digiode

USA . 1,087 parts In-Stock

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1,087

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 479 parts In-Stock

1+ parts

$3.165

100+ parts

-

1k+ parts

$3.685

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479

$3.165

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$3.685

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DigiPath Technology Company

USA . 1,113 parts In-Stock

1+ parts

$3.485

100+ parts

$3.206

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1,113

$3.485

$3.206

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IDEA Electronic Components Group

UK . 743 parts In-Stock

1+ parts

$3.556

100+ parts

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$3.200

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743

$3.556

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$3.200

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ChromeModa Solutions

Germany . 221 parts In-Stock

1+ parts

$3.556

100+ parts

$2.916

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221

$3.556

$2.916

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Semicontronic

India . 510 parts In-Stock

1+ parts

$7.100

100+ parts

$6.922

1k+ parts

$6.887

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510

$7.100

$6.922

$6.887

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AZTECH Wire

Italy . 577 parts In-Stock

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$10.457

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577

$10.457

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One Stop Electronics

USA . 1,495 parts In-Stock

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$22.100

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1,495

$22.100

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Ampacity Inc.

Singapore . 823 parts In-Stock

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$28.100

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823

$28.100

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Corphita

USA . 1,182 parts In-Stock

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Corohmni

South Africa . 463 parts In-Stock

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463

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Overview

Shield your electronics with the TISP3260F3P by Texas Instruments, a top-of-the-line silicon surge protector designed to keep your devices safe from power spikes and surges. Manufactured by the trusted name in electronics, this compact yet powerful device offers peace of mind and protection for your valuable equipment. Perfect for a variety of applications, from home appliances to industrial machinery, this surge protector delivers unmatched reliability and performance. Trust Texas Instruments to safeguard your investments with the TISP3260F3P.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection from external elements, making this surge protector suitable for long-term use.

Configuration: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

The series connected configuration with 2 elements and center tap design enhances the efficiency of the surge protector in diverting voltage spikes away from sensitive electronics, providing reliable protection.

Non Repetitive Peak On-state Current: 6 A

With a non repetitive peak on-state current of 6 A, this surge protector can effectively handle high transient currents during surges, ensuring the safety of connected devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy installation and integration into various electronic systems, offering flexibility in placement and use.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and ease of soldering, ensuring stable electrical contact for efficient surge protection.

No. of Elements: 2

Having 2 elements increases the overall protection capability of the surge protector, making it suitable for safeguarding multiple devices or circuits simultaneously.

No. of Terminals: 8

With 8 terminals, this surge protector offers multiple points of connection, enabling versatile installation options and ensuring reliable protection for a range of electronic equipment.

Package Style (Meter): IN-LINE

The in-line package style allows for a compact and space-saving design, making this surge protector ideal for applications where space is limited or where discrete placement is desired.

Maximum DC Off-state Voltage: 200 V

The maximum DC off-state voltage rating of 200 V ensures that the surge protector can effectively handle high voltage levels, providing robust protection for sensitive electronics.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The use of thyristor surge protector as the trigger device enhances the responsiveness and reliability of the surge protector in quickly diverting excess voltage away from connected devices, offering enhanced protection against surges.

Terminal Position: DUAL

The dual terminal position allows for flexible installation and connection options, accommodating different wiring configurations and making it easier to integrate the surge protector into existing systems.

Maximum Breakdown Voltage: 260 V

With a maximum breakdown voltage of 260 V, this surge protector can effectively clamp voltage spikes above this threshold, preventing damage to sensitive electronics and ensuring reliable surge protection.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures that this surge protector meets strict safety and quality standards, giving users assurance of its reliability and performance in providing surge protection for their electronic devices.

Technical Specifications

Silicon Surge Protectors TISP3260F3P attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

260 V

Maximum DC Off-state Voltage:

200 V

JESD-30 Code:

R-PDIP-T8

Non Repetitive Peak On-state Current:

6 A

No. of Elements:

2

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TISP3260F3P Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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