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TISP4145M3LPR

Texas Instruments

TISP4145M3LPR by Texas Instruments

TISP4145M3LPR by Texas Instruments is a single silicon surge protector with 30A non-repetitive peak on-state current. Its cylindrical package body made of plastic/epoxy houses a thyristor surge protector, ideal for bottom terminal applications requiring a max breakdown voltage of 145V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,238 parts In-Stock

1+ parts

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Digiode

USA . 1,897 parts In-Stock

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1,897

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 905 parts In-Stock

1+ parts

$2.100

100+ parts

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905

$2.100

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Parana Technologies

USA . 1,380 parts In-Stock

1+ parts

$4.345

100+ parts

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1k+ parts

$4.764

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1,380

$4.345

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$4.764

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DigiPath Technology Company

USA . 2,349 parts In-Stock

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$4.784

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2,349

$4.784

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IDEA Electronic Components Group

UK . 2,068 parts In-Stock

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$4.882

100+ parts

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$4.394

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2,068

$4.882

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$4.394

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ChromeModa Solutions

Germany . 536 parts In-Stock

1+ parts

$4.882

100+ parts

$4.003

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536

$4.882

$4.003

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Semicontronic

India . 1,401 parts In-Stock

1+ parts

$11.100

100+ parts

$10.822

1k+ parts

$10.767

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1,401

$11.100

$10.822

$10.767

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AZTECH Wire

Italy . 893 parts In-Stock

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$14.705

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893

$14.705

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One Stop Electronics

USA . 682 parts In-Stock

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$17.100

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682

$17.100

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Corphita

USA . 2,609 parts In-Stock

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2,609

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Corohmni

South Africa . 180 parts In-Stock

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Overview

Protect your valuable electronics with the TISP4145M3LPR by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-quality products that are reliable and durable. The TISP4145M3LPR is a silicon surge protector that offers superior protection against power surges, ensuring the safety of your devices. With a maximum breakdown voltage of 145V and a non-repetitive peak on-state current of 30A, this surge protector is perfect for a variety of applications. Trust Texas Instruments to provide you with the protection and peace of mind you need for your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the surge protector lightweight and durable, perfect for easy installation and long-lasting protection.

Configuration: SINGLE

The single configuration simplifies the installation process and ensures easy setup and operation.

Non Repetitive Peak On-state Current: 30 A

With a high non-repetitive peak on-state current capacity of 30 A, this surge protector can effectively handle sudden power surges without any damage to the connected equipment.

Package Shape: ROUND

The round package shape allows for easy mounting and placement in various locations, making it versatile for different applications.

Terminal Form: WIRE

The wire terminal form provides a secure and reliable connection, ensuring efficient transmission of surge currents for maximum protection.

No. of Terminals: 3

Having 3 terminals allows for easy connectivity and installation, making it suitable for a variety of setups and configurations.

Package Style (Meter): CYLINDRICAL

The cylindrical package style makes the surge protector compact and space-saving, ideal for installations where space is limited.

Trigger Device Type: THYRISTOR SURGE PROTECTOR

The use of a thyristor surge protector as the trigger device ensures fast and reliable response to power surges, providing immediate protection to connected devices.

Terminal Position: BOTTOM

The bottom terminal position makes it easy to connect wires securely, preventing accidental disconnection and ensuring continuous protection.

Maximum Breakdown Voltage: 145 V

With a maximum breakdown voltage of 145 V, this surge protector can effectively suppress surges within this voltage range, safeguarding connected equipment from damage.

Technical Specifications

Silicon Surge Protectors TISP4145M3LPR attributes and parameters. Explore more Silicon Surge Protectors devices from Texas Instruments

Specs

Maximum Breakdown Voltage:

145 V

Configuration:

JESD-30 Code:

O-PBCY-W3

Non Repetitive Peak On-state Current:

30 A

No. of Elements:

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

WIRE

Terminal Position:

Trigger Device Type:

Trade Compliance

TISP4145M3LPR Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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