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NP0160TAT1G

Onsemi

NP0160TAT1G by Onsemi

NP0160TAT1G by Onsemi is a Silicon Surge Protector with 5 Gull Wing terminals. It has a max operating temperature of 125 °C and min of -40°C. This device is used for surge protection in various applications requiring small outline surface mount packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,307 parts In-Stock

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Vyrian

USA . 876 parts In-Stock

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876

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Kulean Microsystems

USA . 5,407 parts In-Stock

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5,407

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TANS Electronics

Latvia . 5,106 parts In-Stock

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5,106

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SupplyDigital Components

Austria . 4,762 parts In-Stock

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4,762

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Problanco Electronics

Mexico . 1,879 parts In-Stock

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1,879

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Corphita

USA . 660 parts In-Stock

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660

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Corohmni

South Africa . 366 parts In-Stock

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366

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UHIMA Technologies

Türkiye . 169 parts In-Stock

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Overview

Protect your electronics with the NP0160TAT1G silicon surge protector by Onsemi. Designed with high-quality materials and advanced technology, this device offers superior protection against voltage spikes and surges. Whether you're safeguarding sensitive equipment in industrial applications or securing home electronics from power fluctuations, this surge protector is a reliable solution. Trust in Onsemi's reputation for excellence in manufacturing to deliver peace of mind and uninterrupted performance. Invest in the NP0160TAT1G today for long-lasting protection and unbeatable value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the surge protector, ensuring a long lifespan.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of the surge protector on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the circuit board, making it ideal for compact designs.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable connections, enhancing the overall performance of the surge protector.

No. of Terminals: 5

Having 5 terminals allows for multiple connection options and compatibility with various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and is suitable for applications with limited area availability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this surge protector can withstand harsh environmental conditions and maintain stability during use.

Trigger Device Type: SILICON SURGE PROTECTOR

The silicon surge protector offers reliable protection against voltage spikes and surges, safeguarding sensitive electronics in the circuit.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the surge protector to function effectively even in cold environments, providing consistent performance.

Terminal Finish: TIN

The tin terminal finish ensures good conductivity and corrosion resistance, contributing to the overall reliability of the surge protector.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in installation and allows for different mounting orientations, increasing the versatility of the surge protector.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure soldering during assembly, enhancing the durability and stability of the surge protector.

Technical Specifications

Silicon Surge Protectors NP0160TAT1G attributes and parameters. Explore more Silicon Surge Protectors devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

NP0160TAT1G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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