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TLP140M

STMicroelectronics

TLP140M by STMicroelectronics

TLP140M by STMicroelectronics is a Silicon Surge Protector with 3 elements in a delta configuration. It has a non-repetitive peak on-state current of 31A and max breakdown voltage of 200V. This surface-mount device is ideal for protecting electronic circuits from voltage surges.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,820

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-

-

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Vyrian

USA . 4,778 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,778

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-

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ECAB

Sweden . 1,528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,528

-

-

-

-

Anansix

USA . 1,312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,312

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,946 parts In-Stock

1+ parts

$3.475

100+ parts

-

1k+ parts

$3.127

10k+ parts

-

1,946

$3.475

-

$3.127

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MKK Technologies

India . 623 parts In-Stock

1+ parts

$6.534

100+ parts

-

1k+ parts

-

10k+ parts

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623

$6.534

-

-

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DigiPath Technology Company

USA . 623 parts In-Stock

1+ parts

$6.534

100+ parts

-

1k+ parts

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10k+ parts

-

623

$6.534

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-

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Corphita

USA . 2,210 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,210

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-

-

-

Parana Technologies

USA . 265 parts In-Stock

1+ parts

-

100+ parts

$4.155

1k+ parts

-

10k+ parts

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265

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$4.155

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Overview

Protect your valuable electronic devices with the TLP140M Silicon Surge Protector by STMicroelectronics. This high-quality product offers reliable surge protection for a wide range of applications, keeping your equipment safe from unexpected power surges. With its advanced technology and durable construction, the TLP140M provides peace of mind and ensures that your devices are always functioning at their best. Trust STMicroelectronics for superior performance and unbeatable quality in surge protection solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the surge protector lightweight and durable, ensuring long-lasting protection for electronic devices.

Configuration: DELTA CONNECTED, 3 ELEMENTS

The delta connected configuration with 3 elements allows for efficient distribution of surge protection across the device, enhancing its overall performance.

Non Repetitive Peak On-state Current: 31 A

With a high non-repetitive peak on-state current of 31 A, this surge protector is capable of handling sudden high voltage surges effectively, safeguarding connected equipment.

Surface Mount: YES

The surface mount feature enables easy installation of the surge protector onto circuit boards or other electronic devices, saving time and effort during setup.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization and integration into compact electronic designs, making it suitable for various applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring proper functionality of the surge protector within the electronic system.

No. of Elements: 3

Having 3 elements enhances the overall surge protection capabilities of the device, making it more effective in suppressing transient voltage spikes.

No. of Terminals: 10

With 10 terminals, the surge protector offers multiple connection points for easy integration into complex electronic setups, ensuring comprehensive protection across various circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates space-saving installation in electronic devices with limited room for components, providing efficient surge protection in compact designs.

Trigger Device Type: SILICON SURGE PROTECTOR

The use of silicon surge protector as the trigger device ensures fast and reliable response to voltage spikes, safeguarding sensitive electronics from damage.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and corrosion resistance, promoting stable electrical connections and prolonging the surge protector's lifespan.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in installation and connection options, allowing for versatile mounting configurations in electronic circuits.

Maximum Breakdown Voltage: 200 V

With a maximum breakdown voltage of 200 V, this surge protector can effectively suppress voltage surges up to the specified limit, protecting connected devices from potential harm.

Technical Specifications

Silicon Surge Protectors TLP140M attributes and parameters. Explore more Silicon Surge Protectors devices from STMicroelectronics

Specs

Maximum Breakdown Voltage:

200 V

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e0

Non Repetitive Peak On-state Current:

31 A

No. of Elements:

3

No. of Terminals:

10

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

TLP140M Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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