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TAS5518PAGRG4

Texas Instruments

TAS5518PAGRG4 by Texas Instruments

TAS5518PAGRG4 by Texas Instruments is a 64-terminal consumer IC with 3.3V power supply, operating b/w 0-70°C. It features a flatpack package style, suitable for various consumer circuit applications requiring a thin profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,307 parts In-Stock

1+ parts

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3,307

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Digiode

USA . 1,702 parts In-Stock

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1,702

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 447 parts In-Stock

1+ parts

$1.276

100+ parts

-

1k+ parts

$2.038

10k+ parts

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447

$1.276

-

$2.038

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DigiPath Technology Company

USA . 29 parts In-Stock

1+ parts

$1.405

100+ parts

$1.293

1k+ parts

-

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29

$1.405

$1.293

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ChromeModa Solutions

Germany . 2,450 parts In-Stock

1+ parts

$1.434

100+ parts

$1.176

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2,450

$1.434

$1.176

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IDEA Electronic Components Group

UK . 679 parts In-Stock

1+ parts

$1.434

100+ parts

-

1k+ parts

$1.291

10k+ parts

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679

$1.434

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$1.291

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One Stop Electronics

USA . 1,283 parts In-Stock

1+ parts

$15.800

100+ parts

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1,283

$15.800

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AZTECH Wire

Italy . 762 parts In-Stock

1+ parts

$16.276

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762

$16.276

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Corphita

USA . 4,312 parts In-Stock

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4,312

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Microchip USA

USA . 1,526 parts In-Stock

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1,526

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TAS5518PAGRG4. This consumer circuit IC offers a wide range of applications and is designed to meet the highest industry standards. With its sleek square package shape and durable plastic/epoxy body material, this IC is perfect for various electronic devices. Enjoy the benefits of a 3.3V power supply, nickel palladium gold terminal finish, and a compact flatpack design. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body provides durability and protection for the internal circuitry of the IC.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration of the IC onto a circuit board.

Power Supplies (V): 3.3

The 3.3V power supply voltage is common in consumer electronics applications, making this IC suitable for a wide range of devices.

No. of Terminals: 64

With 64 terminals, this IC offers versatile connectivity options for various input and output signals.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even in demanding environmental conditions.

Width: 10 mm

The compact width of 10 mm makes this IC suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage of 3V allows for efficient power consumption and compatibility with lower voltage systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density mounting and allows for more terminals to be packed into a smaller area.

Technical Specifications

Other Function Consumer ICs TAS5518PAGRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TAS5518PAGRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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