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TAS5012IPFBG4

Texas Instruments

TAS5012IPFBG4 by Texas Instruments

TAS5012IPFBG4 by Texas Instruments is a consumer IC with 48 terminals, operating at -40 to 85°C. It has a supply voltage range of 3-3.6V and peak reflow temp of 260°C. Ideal for industrial applications requiring thin profile, fine pitch packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,423

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-

-

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Digiode

USA . 2,954 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,954

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,349 parts In-Stock

1+ parts

$1.234

100+ parts

-

1k+ parts

$2.015

10k+ parts

-

1,349

$1.234

-

$2.015

-

DigiPath Technology Company

USA . 1,732 parts In-Stock

1+ parts

$1.358

100+ parts

$1.250

1k+ parts

-

10k+ parts

-

1,732

$1.358

$1.250

-

-

ChromeModa Solutions

Germany . 5,008 parts In-Stock

1+ parts

$1.386

100+ parts

$1.137

1k+ parts

-

10k+ parts

-

5,008

$1.386

$1.137

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-

IDEA Electronic Components Group

UK . 747 parts In-Stock

1+ parts

$1.386

100+ parts

-

1k+ parts

$1.247

10k+ parts

-

747

$1.386

-

$1.247

-

One Stop Electronics

USA . 309 parts In-Stock

1+ parts

$14.800

100+ parts

-

1k+ parts

-

10k+ parts

-

309

$14.800

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-

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AZTECH Wire

Italy . 225 parts In-Stock

1+ parts

$15.527

100+ parts

-

1k+ parts

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10k+ parts

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225

$15.527

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Corphita

USA . 891 parts In-Stock

1+ parts

-

100+ parts

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891

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Overview

Unlock the power of innovation with the TAS5012IPFBG4 by Texas Instruments. As a leader in the semiconductor industry, Texas Instruments delivers top-quality products that push boundaries and inspire creativity. The TAS5012IPFBG4 is a versatile consumer IC that offers unmatched performance and reliability. Whether you're designing audio systems, home appliances, or industrial equipment, this product provides the perfect solution. Experience seamless integration, superior functionality, and cutting-edge technology with the TAS5012IPFBG4. Elevate your projects to the next level and see the difference that Texas Instruments can make for you.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and protection for the internal components of the IC.

Surface Mount: YES

Being surface mountable makes installation and mounting of this IC easier and more efficient.

Power Supplies (V): 3.3

The 3.3V power supply makes this product compatible with a wide range of applications and power sources.

No. of Terminals: 48

Having 48 terminals allows for more connectivity options and versatility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even under challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for use in cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides good conductivity and corrosion resistance for long-term reliability.

Width: 7 mm

The compact width of 7mm allows for space-saving installation in tight PCB layouts.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures stable and secure soldering during assembly.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades means this IC can withstand harsh operating conditions in industrial environments.

Technical Specifications

Other Function Consumer ICs TAS5012IPFBG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TAS5012IPFBG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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