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TAS5010IPFB

Texas Instruments

TAS5010IPFB by Texas Instruments

TAS5010IPFB by Texas Instruments is a 48-terminal consumer IC with 3.3V power supply, operating b/w -40 to 85°C. Its flatpack package style and gull wing terminal form make it suitable for industrial applications requiring compact design and high reliability.

Median Price

$6.580

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,419 parts In-Stock

1+ parts

-

100+ parts

$5.700

1k+ parts

$5.100

10k+ parts

$4.800

11,419

-

$5.700

$5.100

$4.800

DigiKey

USA . 11,419 parts In-Stock

1+ parts

-

100+ parts

$6.580

1k+ parts

-

10k+ parts

-

11,419

-

$6.580

-

-

Verical

USA . 5,500 parts In-Stock

1+ parts

-

100+ parts

$7.125

1k+ parts

$6.375

10k+ parts

$6.000

5,500

-

$7.125

$6.375

$6.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,258 parts In-Stock

1+ parts

$2.600

100+ parts

-

1k+ parts

-

10k+ parts

-

3,258

$2.600

-

-

-

Digiode

USA . 1,596 parts In-Stock

1+ parts

$6.014

100+ parts

-

1k+ parts

-

10k+ parts

-

1,596

$6.014

-

-

-

DigiKey Marketplace

USA . 11,419 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,419

-

-

-

-

Chip Stock

USA . 1,124 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,124

-

-

-

-

EMSNET

USA . 1 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,335 parts In-Stock

1+ parts

$2.092

100+ parts

-

1k+ parts

$2.609

10k+ parts

-

1,335

$2.092

-

$2.609

-

DigiPath Technology Company

USA . 810 parts In-Stock

1+ parts

$2.303

100+ parts

$2.119

1k+ parts

-

10k+ parts

-

810

$2.303

$2.119

-

-

ChromeModa Solutions

Germany . 4,204 parts In-Stock

1+ parts

$2.350

100+ parts

$1.927

1k+ parts

-

10k+ parts

-

4,204

$2.350

$1.927

-

-

IDEA Electronic Components Group

UK . 1,297 parts In-Stock

1+ parts

$2.350

100+ parts

-

1k+ parts

$2.115

10k+ parts

-

1,297

$2.350

-

$2.115

-

Corphita

USA . 2,382 parts In-Stock

1+ parts

$5.697

100+ parts

-

1k+ parts

-

10k+ parts

-

2,382

$5.697

-

-

-

Microchip USA

USA . 107 parts In-Stock

1+ parts

$21.480

100+ parts

$21.170

1k+ parts

$21.020

10k+ parts

$20.860

107

$21.480

$21.170

$21.020

$20.860

A-Z Elektronik GmbH

Germany . 4,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,572

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Kepictronics

USA . 1,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,004

-

-

-

-

Perfect Parts

USA . 588 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

588

-

-

-

-

Overview

Unleash the power of innovation with the TAS5010IPFB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality consumer ICs like no other. This versatile product is ideal for a wide range of applications, offering unmatched performance and reliability. Elevate your projects to the next level with this cutting-edge technology that promises to deliver exceptional value and benefits to customers. Choose Texas Instruments for quality you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good insulation and protection for the IC, ensuring reliability and durability.

Surface Mount: YES

Easy to install and saves space on the PCB, making it suitable for compact electronic devices.

Power Supplies (V): 3.3

Compatible with common power sources, providing stable operation.

Maximum Operating Temperature: 85 °C

Can operate at relatively high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, ensuring reliable performance in various conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance for a long-lasting connection.

Width: 7 mm

Compact size allows for efficient use of PCB space in electronic designs.

Terminal Pitch: 0.5 mm

Fine pitch enables higher density PCB designs and more functionality in a limited space.

Moisture Sensitivity Level (MSL): 2

With MSL 2 rating, the IC can withstand limited exposure to moisture during handling and soldering.

Technical Specifications

Other Function Consumer ICs TAS5010IPFB attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TAS5010IPFB General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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