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TAS5010IPFBG4

Texas Instruments

TAS5010IPFBG4 by Texas Instruments

TAS5010IPFBG4 by Texas Instruments is a 48-terminal IC with 3.3V power supply, operating b/w -40 to 85°C. It features a flatpack package style suitable for consumer circuits in industrial applications. With surface mount capability and thin profile, it offers high performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,006 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,006

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Chip Stock

USA . 1,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,025

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Digiode

USA . 422 parts In-Stock

1+ parts

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422

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,410 parts In-Stock

1+ parts

$1.239

100+ parts

-

1k+ parts

$2.017

10k+ parts

-

1,410

$1.239

-

$2.017

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DigiPath Technology Company

USA . 1,277 parts In-Stock

1+ parts

$1.364

100+ parts

$1.255

1k+ parts

-

10k+ parts

-

1,277

$1.364

$1.255

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ChromeModa Solutions

Germany . 6,513 parts In-Stock

1+ parts

$1.392

100+ parts

$1.141

1k+ parts

-

10k+ parts

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6,513

$1.392

$1.141

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IDEA Electronic Components Group

UK . 2,357 parts In-Stock

1+ parts

$1.392

100+ parts

-

1k+ parts

$1.253

10k+ parts

-

2,357

$1.392

-

$1.253

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One Stop Electronics

USA . 774 parts In-Stock

1+ parts

$4.800

100+ parts

-

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10k+ parts

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774

$4.800

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AZTECH Wire

Italy . 631 parts In-Stock

1+ parts

$9.278

100+ parts

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631

$9.278

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Corphita

USA . 4,114 parts In-Stock

1+ parts

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4,114

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Microchip USA

USA . 405 parts In-Stock

1+ parts

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405

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Overview

Unlock the potential of your consumer electronic designs with the TAS5010IPFBG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. The TAS5010IPFBG4 is a versatile IC suitable for various applications, offering unmatched reliability and performance. Enhance your product's functionality and efficiency with this innovative solution. Trust Texas Instruments to provide you with the best-in-class components for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good durability and protection for the IC, making it suitable for a variety of consumer applications.

Surface Mount: YES

Being surface mount compatible makes it easier for PCB assembly, saving time and effort in the manufacturing process.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and can facilitate easier layout and routing.

Power Supplies (V): 3.3

The 3.3V power supply is commonly used in consumer electronics, providing compatibility with a wide range of devices.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this IC can operate reliably in harsh environments, making it suitable for industrial applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting on the PCB, increasing component integration and saving space.

Technical Specifications

Other Function Consumer ICs TAS5010IPFBG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TAS5010IPFBG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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