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TAS5001IPFBR

Texas Instruments

TAS5001IPFBR by Texas Instruments

TAS5001IPFBR by Texas Instruments is a 48-terminal consumer IC with power supply of 3.3V, operating temperature range from -40 to 85°C. It features a flatpack package style suitable for industrial applications requiring thin profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,651 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,651

-

-

-

-

Vyrian

USA . 2,529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,529

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,226 parts In-Stock

1+ parts

$3.131

100+ parts

-

1k+ parts

$3.653

10k+ parts

-

2,226

$3.131

-

$3.653

-

DigiPath Technology Company

USA . 1,712 parts In-Stock

1+ parts

$3.448

100+ parts

$3.172

1k+ parts

-

10k+ parts

-

1,712

$3.448

$3.172

-

-

ChromeModa Solutions

Germany . 5,147 parts In-Stock

1+ parts

$3.518

100+ parts

$2.885

1k+ parts

-

10k+ parts

-

5,147

$3.518

$2.885

-

-

IDEA Electronic Components Group

UK . 390 parts In-Stock

1+ parts

$3.518

100+ parts

-

1k+ parts

$3.166

10k+ parts

-

390

$3.518

-

$3.166

-

AZTECH Wire

Italy . 866 parts In-Stock

1+ parts

$7.798

100+ parts

-

1k+ parts

-

10k+ parts

-

866

$7.798

-

-

-

One Stop Electronics

USA . 1,224 parts In-Stock

1+ parts

$8.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,224

$8.800

-

-

-

Corphita

USA . 2,260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,260

-

-

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Overview

Discover the superior quality and innovative design of the TAS5001IPFBR by Texas Instruments, a leading manufacturer in the industry. This cutting-edge consumer circuit IC offers unmatched performance and reliability, making it ideal for a wide range of applications. With its compact square package style and advanced features, this product provides exceptional value and benefits to customers looking for top-notch electronic components. Unlock new possibilities and elevate your projects with the TAS5001IPFBR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, making it suitable for various consumer applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: SQUARE

Square package shape helps in optimizing space on the PCB and allows for efficient placement of the IC within the system design.

Power Supplies (V): 3.3

Operating at 3.3V power supply makes it compatible with standard logic levels, ensuring seamless integration with other components.

No. of Terminals: 48

A higher number of terminals allow for more connectivity options, enabling versatility in circuit design and functionality.

Maximum Operating Temperature: 85 °C

With a high operating temperature range of 85°C, the IC can withstand demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The IC can operate efficiently in extreme cold temperatures as low as -40°C, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers excellent conductivity and corrosion resistance, enhancing the longevity and performance of the IC.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5mm allows for compact placement of terminals, enabling higher density PCB designs and efficient use of space.

Moisture Sensitivity Level (MSL): 2

Having a moisture sensitivity level of 2 indicates that the IC has a moderate resistance to moisture, ensuring reliability in varying environmental conditions.

Technical Specifications

Other Function Consumer ICs TAS5001IPFBR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TAS5001IPFBR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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