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TAS5010PFBRG4

Texas Instruments

TAS5010PFBRG4 by Texas Instruments

TAS5010PFBRG4 by Texas Instruments is a 48-terminal consumer IC with 3.3V power supply, operating b/w 0-70°C. It features a flatpack package style, suitable for various consumer circuit applications requiring a thin profile and fine pitch design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,777 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,777

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Digiode

USA . 1,323 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,323

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 803 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

$2.327

10k+ parts

-

803

$1.755

-

$2.327

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DigiPath Technology Company

USA . 1,042 parts In-Stock

1+ parts

$1.933

100+ parts

$1.778

1k+ parts

-

10k+ parts

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1,042

$1.933

$1.778

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ChromeModa Solutions

Germany . 3,006 parts In-Stock

1+ parts

$1.972

100+ parts

$1.617

1k+ parts

-

10k+ parts

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3,006

$1.972

$1.617

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IDEA Electronic Components Group

UK . 2,113 parts In-Stock

1+ parts

$1.972

100+ parts

-

1k+ parts

$1.775

10k+ parts

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2,113

$1.972

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$1.775

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AZTECH Wire

Italy . 598 parts In-Stock

1+ parts

$15.927

100+ parts

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598

$15.927

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One Stop Electronics

USA . 634 parts In-Stock

1+ parts

$17.800

100+ parts

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634

$17.800

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Corphita

USA . 2,384 parts In-Stock

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2,384

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Overview

Enhance your consumer electronics with the TAS5010PFBRG4 from Texas Instruments, a leading manufacturer known for high-quality products. This versatile IC offers a wide range of applications in various consumer circuits, providing a reliable solution for your electronic needs. With a compact design and durable plastic/epoxy material, this IC is built to last. Experience the value and benefits of Texas Instruments' expertise in engineering as you elevate your products with the TAS5010PFBRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for consumer applications.

Surface Mount: YES

Surface-mount technology allows for easy and efficient PCB assembly, saving on space and reducing manufacturing costs.

Package Shape: SQUARE

The square shape of the package provides a uniform footprint, making it easier for placement on the PCB and optimizing space usage.

Power Supplies (V): 3.3

The 3.3V power supply allows for compatibility with various consumer electronic devices and ensures efficient power consumption.

No. of Terminals: 48

Having a high number of terminals provides flexibility in connectivity options and allows for a wide range of functionalities to be implemented.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the reliability and stability of the product even under challenging environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature guarantees functionality in a wide range of environments, from extreme cold to room temperature.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity, corrosion resistance, and solderability, enhancing the overall reliability and longevity of the product.

Maximum Seated Height: 1.2 mm

The low seated height allows for a slim profile, enabling the product to be used in space-constrained consumer applications.

Width: 7 mm

The compact width of the package makes it suitable for small form factor devices and helps in optimizing the space on the PCB.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage requirement ensures compatibility with a wide range of power sources commonly found in consumer electronics.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that the product can withstand standard moisture exposure during handling and storage, ensuring reliability in typical operating conditions.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage tolerance provides a safety margin for voltage spikes and fluctuations, enhancing the overall robustness of the product.

Technical Specifications

Other Function Consumer ICs TAS5010PFBRG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TAS5010PFBRG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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