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TACT2150-20NT

Texas Instruments

TACT2150-20NT by Texas Instruments

TACT2150-20NT by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V. It features open-drain output characteristics and operates in temperatures ranging from 0 to 70°C. This CMOS technology device comes in an in-line package style, making it suitable for various commercial applications requiring precise arithmetic calculations.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,203 parts In-Stock

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Digiode

USA . 4,866 parts In-Stock

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Prism Electronics

USA . 150 parts In-Stock

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Electronic Expediters

USA . 41 parts In-Stock

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Inventory MP

USA . 12 parts In-Stock

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Bristol Electronics

USA . 12 parts In-Stock

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Andel Nordic

Denmark . 5,001 parts In-Stock

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$4.548

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$4.366

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$4.366

5,001

$4.548

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$4.366

Parana Technologies

USA . 702 parts In-Stock

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$15.808

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$16.168

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702

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DigiPath Technology Company

USA . 1,864 parts In-Stock

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$17.407

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$16.014

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IDEA Electronic Components Group

UK . 2,208 parts In-Stock

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$17.762

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$16.874

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$15.986

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ChromeModa Solutions

Germany . 1,625 parts In-Stock

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$17.762

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$14.565

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AZTECH Wire

Italy . 462 parts In-Stock

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$18.207

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One Stop Electronics

USA . 1,516 parts In-Stock

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Corphita

USA . 957 parts In-Stock

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Perfect Parts

USA . 308 parts In-Stock

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Overview

Upgrade your digital arithmetic circuits with the TACT2150-20NT by Texas Instruments. Experience unparalleled quality and reliability from a trusted manufacturer. This product offers countless applications in various industries, providing customers with value and flexibility. With its advanced features and benefits, this innovative device is sure to exceed your expectations and enhance your projects like never before. Choose Texas Instruments for superior performance and endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the circuit, making it suitable for various environments.

No. of Bits: 8

Having 8 bits allows for a higher resolution in arithmetic calculations, making this product suitable for complex digital operations.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is commonly used in digital circuits, ensuring compatibility with most systems.

Output Characteristics: OPEN-DRAIN

The open-drain output allows for versatile interfacing with other components or systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable.

Technical Specifications

Digital Arithmetic Circuits TACT2150-20NT attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

TACT21

JESD-30 Code:

R-PDIP-T24

Length:

31.64 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TACT2150-20NT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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