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SNJ54S374FK

Texas Instruments

SNJ54S374FK by Texas Instruments

SNJ54S374FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 28ns at 5V. It features a TTL technology, operates b/w -55 to 125°C, and has a max frequency of 75MHz. Ideal for military applications requiring true output polarity and positive edge triggering in a ceramic chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,353 parts In-Stock

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3,353

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Vyrian

USA . 3,106 parts In-Stock

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3,106

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Bristol Electronics

USA . 15 parts In-Stock

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15

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Resion

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 624 parts In-Stock

1+ parts

$5.000

100+ parts

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624

$5.000

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AZTECH Wire

Italy . 427 parts In-Stock

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$6.799

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427

$6.799

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Andel Nordic

Denmark . 2,346 parts In-Stock

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$7.043

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$6.762

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$6.762

2,346

$7.043

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$6.762

$6.762

Parana Technologies

USA . 2,173 parts In-Stock

1+ parts

$20.507

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$20.574

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2,173

$20.507

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$20.574

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DigiPath Technology Company

USA . 44 parts In-Stock

1+ parts

$22.581

100+ parts

$20.775

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44

$22.581

$20.775

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ChromeModa Solutions

Germany . 2,638 parts In-Stock

1+ parts

$23.042

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$18.894

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2,638

$23.042

$18.894

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IDEA Electronic Components Group

UK . 1,398 parts In-Stock

1+ parts

$23.042

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$21.890

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$20.738

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1,398

$23.042

$21.890

$20.738

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Ampacity Inc.

Singapore . 625 parts In-Stock

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$62.000

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$62.000

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Corphita

USA . 1,727 parts In-Stock

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1,727

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Microchip USA

USA . 1,654 parts In-Stock

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Overview

Unleash the power of seamless data transmission with the Texas Instruments SNJ54S374FK Bus Driver & Transceivers! Crafted with precision and reliability in mind, this product boasts superior quality and performance. Ideal for a wide range of applications, this chip carrier package is designed to provide customers with fast, efficient, and accurate signal control. Experience the value of quick propagation delay, advanced 3-STATE output characteristics, and a MILITARY-grade temperature rating. Elevate your electronic projects with the trusted excellence of Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability of the product, making it suitable for harsh operating conditions.

Propagation Delay At Nominal Supply: 28 ns

With a low propagation delay, this product offers fast signal transmission, making it ideal for applications that require quick response times.

Nominal Supply Voltage / Vsup (V): 5

Operating at a commonly used voltage of 5V makes this product compatible with a wide range of systems and easily integrable into existing setups.

Technology: TTL

Utilizing TTL technology ensures compatibility with other TTL-based components, simplifying system design and integration.

Maximum Frequency At Nominal Supply: 75000000 Hz

With a high maximum frequency capability, this product is suitable for high-speed data transmission applications, making it a versatile choice.

Technical Specifications

Bus Driver & Transceivers SNJ54S374FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

S

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

20 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

140 mA

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

28 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Trade Compliance

SNJ54S374FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-275-6634, 5962012756634

NIIN

012756634

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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