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SNJ54F374W

Texas Instruments

SNJ54F374W by Texas Instruments

SNJ54F374W by Texas Instruments is an 8-bit bus driver with a propagation delay of 11ns at 5V. It features a MIL-PRF-38535 screening level, operates b/w -55 to 125°C, and has a max frequency of 60MHz. Ideal for military-grade applications requiring fast signal transmission in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,296 parts In-Stock

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Digiode

USA . 3,138 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 398 parts In-Stock

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$4.000

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398

$4.000

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Andel Nordic

Denmark . 821 parts In-Stock

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$5.342

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$5.129

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$5.129

821

$5.342

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$5.129

$5.129

Parana Technologies

USA . 2,075 parts In-Stock

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$14.764

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$15.202

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$14.764

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$15.202

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AZTECH Wire

Italy . 343 parts In-Stock

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$15.907

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343

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DigiPath Technology Company

USA . 1,348 parts In-Stock

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$16.257

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$16.257

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ChromeModa Solutions

Germany . 6,595 parts In-Stock

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$16.589

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$13.603

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$16.589

$13.603

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IDEA Electronic Components Group

UK . 156 parts In-Stock

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$16.589

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$15.760

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$14.930

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156

$16.589

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$14.930

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Ampacity Inc.

Singapore . 766 parts In-Stock

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$62.000

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Lixinc

USA . 5,379 parts In-Stock

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Corphita

USA . 4,104 parts In-Stock

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Microchip USA

USA . 1,688 parts In-Stock

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Overview

Enhance your electronic designs with the SNJ54F374W by Texas Instruments, a top-quality bus driver & transceiver designed to deliver reliable performance in a variety of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product offers exceptional value, benefits, and advantages to customers. Whether you're working on industrial controls, telecommunications, or automotive systems, the SNJ54F374W provides the precision and efficiency you need to take your projects to the next level. Elevate your designs with this versatile component today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and protection for the internal components, making this product reliable in harsh environments.

Propagation Delay At Nominal Supply: 11 ns

The low propagation delay of 11 ns ensures fast signal transmission, making this bus driver & transceiver suitable for high-speed communication applications.

Surface Mount: YES

The surface mount feature allows for easy installation on PCBs, saving space and simplifying the assembly process.

No. of Bits: 8

With 8 bits, this bus driver & transceiver can handle a decent amount of data, making it suitable for various communication protocols and interfaces.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V, this product can be easily integrated into existing systems without requiring additional power management.

Maximum Operating Temperature: 125 °C

The wide operating temperature range of up to 125°C allows this product to perform reliably in both industrial and military applications.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate logic control, enabling efficient bus sharing and minimizing signal contention in multi-device communication systems.

Technical Specifications

Bus Driver & Transceivers SNJ54F374W attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

F/FAST

JESD-30 Code:

R-GDFP-F20

JESD-609 Code:

e0

Length:

13.09 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

60000000 Hz

Maximum I (ol):

20 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL20,.3

Package Shape:

Package Style (Meter):

FLATPACK

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

86 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.45 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.92 mm

Trade Compliance

SNJ54F374W Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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