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SNJ54F283FK

Texas Instruments

SNJ54F283FK by Texas Instruments

SNJ54F283FK by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 10.5 ns at 5V supply, suitable for military applications. It features a max operating temperature of 125°C, true output polarity, and MIL-PRF-38535 screening level. This chip carrier package has 20 terminals and is surface mountable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,853 parts In-Stock

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3,853

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Digiode

USA . 2,573 parts In-Stock

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2,573

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Distributors (Availability)

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Andel Nordic

Denmark . 708 parts In-Stock

1+ parts

$6.724

100+ parts

-

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$6.455

10k+ parts

$6.455

708

$6.724

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$6.455

$6.455

AZTECH Wire

Italy . 246 parts In-Stock

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$10.592

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246

$10.592

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Parana Technologies

USA . 151 parts In-Stock

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$21.646

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$22.060

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151

$21.646

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$22.060

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DigiPath Technology Company

USA . 319 parts In-Stock

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$23.835

100+ parts

$21.928

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319

$23.835

$21.928

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ChromeModa Solutions

Germany . 1,108 parts In-Stock

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$24.321

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$19.943

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1,108

$24.321

$19.943

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IDEA Electronic Components Group

UK . 731 parts In-Stock

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$24.321

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$23.105

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$21.889

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731

$24.321

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$21.889

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One Stop Electronics

USA . 496 parts In-Stock

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$56.000

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Microchip USA

USA . 1,992 parts In-Stock

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Corphita

USA . 1,015 parts In-Stock

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Perfect Parts

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Overview

Elevate your digital arithmetic circuits with the SNJ54F283FK by Texas Instruments. Crafted with precision and expertise, this chip carrier package offers unparalleled performance and reliability for your applications. Whether you're designing calculators, counters, or other arithmetic logic units, this military-grade component ensures fast propagation delay and true output polarity. Trust in Texas Instruments to deliver cutting-edge technology that enhances your projects while providing peace of mind. Upgrade to the SNJ54F283FK and experience the quality and value that only Texas Instruments can offer.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ensures high reliability and durability of the circuit in various operating conditions.

Propagation Delay At Nominal Supply: 10.5 ns

Provides fast response time, making this product suitable for applications requiring quick calculations.

Surface Mount: YES

Easy to integrate into circuit boards, reducing assembly time and labor costs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common voltage level, making it compatible with standard power supplies.

No. of Bits: 4

Suitable for applications that require processing operations with a moderate level of precision.

Temperature Grade: MILITARY

Designed to meet stringent military standards for performance and reliability.

Technology: TTL

Utilizes TTL technology known for its high-speed operation and robustness.

Technical Specifications

Digital Arithmetic Circuits SNJ54F283FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; PERMITS RIPPLE CARRY CASCADING

Family:

F/FAST

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

55 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

14 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

SNJ54F283FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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