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SNJ54AS574J

Texas Instruments

SNJ54AS574J by Texas Instruments

SNJ54AS574J by Texas Instruments is an 8-bit bus driver with a propagation delay of 11ns at 5V, suitable for military applications. It features a max frequency of 100MHz, operates b/w -55 to 125°C, and has a power supply current of 134mA. The TTL technology device has a true output polarity and enables low control type.

Median Price

$3.479

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 4 parts In-Stock

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$3.479

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Digiode

USA . 4,338 parts In-Stock

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Vyrian

USA . 2,266 parts In-Stock

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Sogenti Electronics

Canada . 18 parts In-Stock

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EPE Components Inc.

USA . 5 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 867 parts In-Stock

1+ parts

$6.554

100+ parts

-

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$6.292

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$6.292

867

$6.554

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$6.292

$6.292

AZTECH Wire

Italy . 444 parts In-Stock

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$10.340

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444

$10.340

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Parana Technologies

USA . 124 parts In-Stock

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$21.539

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$21.926

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124

$21.539

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$21.926

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IDEA Electronic Components Group

UK . 1,657 parts In-Stock

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$24.201

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$22.991

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$21.781

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ChromeModa Solutions

Germany . 696 parts In-Stock

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$24.201

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$19.845

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One Stop Electronics

USA . 829 parts In-Stock

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$26.000

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Corphita

USA . 2,003 parts In-Stock

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Microchip USA

USA . 1,466 parts In-Stock

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DigiPath Technology Company

USA . 218 parts In-Stock

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$21.820

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Kepictronics

USA . 92 parts In-Stock

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Perfect Parts

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Overview

Elevate your electronic designs with the SNJ54AS574J by Texas Instruments, a high-quality bus driver and transceiver that offers reliability and precision. Manufactured with top-notch materials and screened at MIL-PRF-38535 level, this component ensures optimal performance in demanding environments. With a true output polarity and positive edge trigger type, this 8-bit device provides seamless integration and fast propagation delay of 11 ns. Experience the benefits of Texas Instruments' cutting-edge technology and trust in the value this product brings to your applications.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and reliability, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 11 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Screening Level: MIL-PRF-38535

This screening level ensures high quality and reliability, meeting stringent military standards.

No. of Bits: 8

Provides sufficient data transmission capacity for various applications.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage supply makes this product compatible with common power sources.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows this product to function in diverse environmental conditions.

Technical Specifications

Bus Driver & Transceivers SNJ54AS574J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 374

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AS

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

100000000 Hz

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

134 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Trade Compliance

SNJ54AS574J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-444-6617, 5962014446617

NIIN

014446617

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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