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SNJ54AHC374FK

Texas Instruments

SNJ54AHC374FK by Texas Instruments

SNJ54AHC374FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.5 ns at 3.3V, suitable for military-grade applications. It features a max frequency of 75MHz, operates b/w -55 to 125°C, and has a low power supply current of 0.04mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,474 parts In-Stock

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Digiode

USA . 1,767 parts In-Stock

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One Stop Electronics

USA . 412 parts In-Stock

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$3.000

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$3.000

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Andel Nordic

Denmark . 35 parts In-Stock

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$5.685

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$5.457

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$5.457

35

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$5.457

$5.457

AZTECH Wire

Italy . 701 parts In-Stock

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$16.147

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701

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Parana Technologies

USA . 19 parts In-Stock

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$25.307

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$25.932

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$25.307

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DigiPath Technology Company

USA . 1,976 parts In-Stock

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$27.866

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$25.637

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$27.866

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ChromeModa Solutions

Germany . 6,957 parts In-Stock

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$28.435

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$23.317

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$28.435

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IDEA Electronic Components Group

UK . 1,293 parts In-Stock

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$28.435

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$27.013

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$25.592

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Corphita

USA . 2,624 parts In-Stock

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Microchip USA

USA . 2,567 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the SNJ54AHC374FK Bus Driver & Transceiver. This versatile chip carrier offers 8 bits of output with a fast propagation delay, ideal for a wide range of applications. With a military-grade screening level and a maximum operating temperature of 125°C, this device is built to last in even the harshest environments. Trust Texas Instruments to deliver cutting-edge technology that meets your needs with precision and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material ensures durability and reliability, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay allows for fast data transmission and efficient operation.

Surface Mount: YES

Surface mount capability makes installation and removal of the product easy and convenient.

Package Shape: SQUARE

Square package shape provides efficient use of space and easy integration into circuit designs.

No. of Bits: 8

8 bits allow for a wide range of data processing and communication capabilities.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages, making it easy to integrate into existing systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in a variety of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Technical Specifications

Bus Driver & Transceivers SNJ54AHC374FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

18.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

8.89 mm

Trade Compliance

SNJ54AHC374FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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