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SNJ54AHC373J

Texas Instruments

SNJ54AHC373J by Texas Instruments

SNJ54AHC373J by Texas Instruments is an 8-bit bus driver with a propagation delay of 10.5 ns and operates at a supply voltage range of 2-5.5 V. It features a MILITARY-grade screening level, suitable for applications requiring high reliability in harsh environments such as aerospace and defense systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,691 parts In-Stock

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5,691

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Digiode

USA . 1,014 parts In-Stock

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1,014

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Distributors (Availability)

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Andel Nordic

Denmark . 294 parts In-Stock

1+ parts

$4.139

100+ parts

-

1k+ parts

$3.974

10k+ parts

$3.974

294

$4.139

-

$3.974

$3.974

AZTECH Wire

Italy . 550 parts In-Stock

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$12.103

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550

$12.103

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Parana Technologies

USA . 916 parts In-Stock

1+ parts

$17.425

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$17.627

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916

$17.425

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$17.627

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DigiPath Technology Company

USA . 2,237 parts In-Stock

1+ parts

$19.187

100+ parts

$17.652

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2,237

$19.187

$17.652

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ChromeModa Solutions

Germany . 5,039 parts In-Stock

1+ parts

$19.579

100+ parts

$16.055

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5,039

$19.579

$16.055

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IDEA Electronic Components Group

UK . 601 parts In-Stock

1+ parts

$19.579

100+ parts

$18.600

1k+ parts

$17.621

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601

$19.579

$18.600

$17.621

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One Stop Electronics

USA . 462 parts In-Stock

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$36.000

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462

$36.000

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Microchip USA

USA . 2,455 parts In-Stock

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2,455

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Corphita

USA . 2,217 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the SNJ54AHC373J bus driver & transceiver. Designed for military-grade applications, this 8-bit component offers fast propagation delay, low power consumption, and a wide operating temperature range. With its 3-STATE output and enable low control type, this versatile IC is perfect for a variety of communication systems, data buses, and industrial equipment. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability, making this product suitable for rugged environments.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast and efficient data transmission, making this product ideal for high-speed communication applications.

Screening Level: MIL-PRF-38535

Compliance with MIL-PRF-38535 screening level standards ensures high quality and reliability, making this product suitable for military and aerospace applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common and widely available, making integration with existing systems easy and convenient.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this product to reliably perform in harsh external conditions.

Technical Specifications

Bus Driver & Transceivers SNJ54AHC373J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNJ54AHC373J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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