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SNJ54AC245J

Texas Instruments

SNJ54AC245J by Texas Instruments

SNJ54AC245J by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.5 ns, suitable for military applications. It operates at a nominal voltage of 3.3V and has a max operating temperature of 125°C. With CMOS technology and dual terminal position, it offers bidirectional control in an inline package style.

Median Price

$20.240

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 60 parts In-Stock

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$20.240

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Digiode

USA . 2,801 parts In-Stock

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Vyrian

USA . 2,740 parts In-Stock

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Astute Electronics Inc

. 54 parts In-Stock

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Bristol Electronics

USA . 48 parts In-Stock

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Atlantic Semiconductor

USA . 48 parts In-Stock

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Electronics Depot

USA . 28 parts In-Stock

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TME

Poland . 20 parts In-Stock

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$21.810

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Microfarads

USA . 4 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 2 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 441 parts In-Stock

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$3.447

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$3.309

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$3.309

441

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$3.309

Ampacity Inc.

Singapore . 60 parts In-Stock

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$17.200

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Parana Technologies

USA . 2,211 parts In-Stock

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$17.284

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$1,605.063

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$15.555

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$1,605.063

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AZTECH Wire

Italy . 226 parts In-Stock

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$18.950

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DigiPath Technology Company

USA . 812 parts In-Stock

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$19.032

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$17.509

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IDEA Electronic Components Group

UK . 1,852 parts In-Stock

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$19.420

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$18.449

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$17.478

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ChromeModa Solutions

Germany . 471 parts In-Stock

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$19.420

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$15.924

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A-Z Elektronik GmbH

Germany . 7,128 parts In-Stock

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Corphita

USA . 4,589 parts In-Stock

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Microchip USA

USA . 2,574 parts In-Stock

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Overview

Enhance your electronic designs with the SNJ54AC245J by Texas Instruments, a high-quality bus driver & transceiver that offers exceptional performance and reliability. With a MIL-PRF-38535 screening level and a wide operating temperature range, this versatile component is ideal for a variety of applications. Benefit from its fast propagation delay, low power consumption, and 3-STATE output characteristics. Trust in Texas Instruments' reputation for excellence and innovation to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability, ensuring the product can withstand harsh environments and frequent use.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay ensures fast and efficient communication, making this product suitable for high-speed data transmission.

Screening Level: MIL-PRF-38535

Meets stringent military standards, guaranteeing high quality and reliability for critical applications.

Nominal Supply Voltage: 3.3V

Operates at a common voltage level, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for use in challenging environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SNJ54AC245J attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

5.08 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

7.62 mm

Trade Compliance

SNJ54AC245J Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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