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SN74LVTH373DWRG4

Texas Instruments

SN74LVTH373DWRG4 by Texas Instruments

SN74LVTH373DWRG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 3.9 ns at 3.3V, suitable for industrial applications. It features a 3-STATE output and operates within a temperature range of -40 to 85°C, making it ideal for use in various electronic systems requiring fast signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,766 parts In-Stock

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Digiode

USA . 114 parts In-Stock

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114

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Distributors (Availability)

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Andel Nordic

Denmark . 2,660 parts In-Stock

1+ parts

$4.552

100+ parts

-

1k+ parts

$4.370

10k+ parts

$4.370

2,660

$4.552

-

$4.370

$4.370

Parana Technologies

USA . 1,838 parts In-Stock

1+ parts

$10.384

100+ parts

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$10.898

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1,838

$10.384

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$10.898

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ChromeModa Solutions

Germany . 1,273 parts In-Stock

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$11.667

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$9.567

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$11.667

$9.567

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IDEA Electronic Components Group

UK . 1,081 parts In-Stock

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$11.667

100+ parts

$11.084

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$10.500

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1,081

$11.667

$11.084

$10.500

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AZTECH Wire

Italy . 387 parts In-Stock

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$14.826

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387

$14.826

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One Stop Electronics

USA . 318 parts In-Stock

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$37.000

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318

$37.000

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Component Stockers USA

USA . 285 parts In-Stock

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$99.990

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Corphita

USA . 3,982 parts In-Stock

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Microchip USA

USA . 2,829 parts In-Stock

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DigiPath Technology Company

USA . 2,364 parts In-Stock

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$10.519

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2,364

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$10.519

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Overview

Enhance your electronic projects with the SN74LVTH373DWRG4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. As part of the Bus Driver & Transceivers category, this product offers reliable performance and versatility in various applications. With a nominal supply voltage of 3.3V and a propagation delay of just 3.9ns, it provides efficient signal transmission while maintaining low power consumption. Trust Texas Instruments to deliver cutting-edge technology that ensures seamless integration and exceptional results, making the SN74LVTH373DWRG4 a valuable asset for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the product, making it reliable for long-term use.

Propagation Delay At Nominal Supply: 3.9 ns

With a low propagation delay at nominal supply voltage, this product ensures efficient and fast signal transmission, making it ideal for high-speed communication applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

No. of Bits: 8

Having 8 bits allows for higher resolution and accuracy in data transmission, making this product suitable for applications that require precision.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V provides compatibility with common power sources, ensuring easy integration into existing systems.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF helps in reducing signal distortion and improving overall signal quality, making this product suitable for high-frequency applications.

Power Supplies (V): 3.3

With a power supply of 3.3V, this product operates efficiently within standard voltage ranges, ensuring reliable performance.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options, making this product suitable for a wide range of applications that require multiple connections.

Maximum I (ol): 64 Amp

The high maximum output current of 64A ensures robust signal output capabilities, making this product suitable for demanding applications that require high power handling.

Propagation Delay (tpd): 4.9 ns

The low propagation delay of 4.9 ns ensures fast signal transmission, reducing signal latency and improving overall system efficiency.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand higher temperatures, making it suitable for industrial environments where heat dissipation is a concern.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signal, allowing for tri-state logic operation and reducing signal interference in complex systems.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable operation in extreme cold conditions, making this product suitable for outdoor or harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent corrosion resistance and ensures reliable connections, making this product suitable for long-term use in diverse environments.

No. of Ports: 2

Having 2 ports allows for multiple input/output connections, increasing the versatility and functionality of this product for various communication applications.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65 mm allows for compact and space-efficient designs, making this product suitable for applications with limited space constraints.

Width: 7.5 mm

The width of 7.5 mm provides a slim and streamlined form factor, making this product suitable for applications where space efficiency is a priority.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission without inversion, making this product suitable for applications that require precise signal representation.

Minimum Supply Voltage (Vsup): 2.7 V

With a minimum supply voltage of 2.7V, this product can operate efficiently even at lower power levels, making it suitable for low-power applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering during manufacturing processes, ensuring secure and durable connections.

Length: 12.8 mm

The length of 12.8 mm provides a compact and space-saving design, making this product suitable for applications where size constraints are a consideration.

Temperature Grade: INDUSTRIAL

Being industrial-grade ensures that this product meets stringent quality and reliability standards, making it suitable for use in demanding industrial environments.

Technology: BICMOS

The use of BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption, making this product suitable for high-performance applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, making this product suitable for applications that require stable electrical connections.

Packing Method: TR

The TR packing method ensures secure packaging and handling during transportation and storage, protecting the product from damage and ensuring product integrity.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm provides compatibility with standard PCB layouts and allows for easy integration into existing circuit designs, making this product versatile and easy to use.

Count Direction: UNIDIRECTIONAL

Being unidirectional ensures that data transmission occurs in one direction only, minimizing signal interference and ensuring reliable communication, making this product suitable for unidirectional applications.

Control Type: ENABLE LOW

The enable low control type allows for easy and efficient signal control, making this product suitable for applications that require straightforward signal management.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this product can withstand voltage fluctuations, ensuring stable and reliable performance in dynamic operating conditions.

Maximum Power Supply Current (ICC): 5 mA

The low maximum power supply current of 5mA ensures energy efficiency and low power consumption, making this product suitable for battery-powered or low-power applications.

Technical Specifications

Bus Driver & Transceivers SN74LVTH373DWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74LVTH373DWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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