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SN74LVT8980ADWRG4

Texas Instruments

SN74LVT8980ADWRG4 by Texas Instruments

SN74LVT8980ADWRG4 by Texas Instruments is a CMOS microprocessor circuit with 24 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 2.7V to 3.6V and consumes up to 7mA current. Ideal for industrial applications requiring an external data bus width of 8 bits in a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 4,615 parts In-Stock

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Vyrian

USA . 2,405 parts In-Stock

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Bristol Electronics

USA . 330 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 278 parts In-Stock

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Dan-Mar Components

USA . 278 parts In-Stock

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AZTECH Wire

Italy . 223 parts In-Stock

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$5.668

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One Stop Electronics

USA . 934 parts In-Stock

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Corohmni

South Africa . 1,907 parts In-Stock

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Parana Technologies

USA . 947 parts In-Stock

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DigiPath Technology Company

USA . 829 parts In-Stock

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ChromeModa Solutions

Germany . 4,787 parts In-Stock

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$74.229

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$60.868

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IDEA Electronic Components Group

UK . 2,200 parts In-Stock

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$74.229

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$70.518

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QUARKTWIN TECHNOLOGY LTD

USA . 3,741 parts In-Stock

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Microchip USA

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Corphita

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Overview

Enhance your electronic projects with the SN74LVT8980ADWRG4 by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments offers cutting-edge solutions in the field of Other Function uPs,uCs & Peripheral ICs. This versatile IC boasts a wide range of applications and is the perfect choice for industrial-grade projects that require high performance and efficiency. With a wide supply voltage range and compact package design, this product provides unmatched value and convenience to customers looking to elevate their designs to the next level. Trust Texas Instruments for all your semiconductor needs and experience the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, which is ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on circuit boards, saving space and reducing overall system cost.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage capability provides flexibility in power input options, suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape is standard and easy to handle during manufacturing and assembly processes.

Power Supplies (V): 3/3.3

The dual power supply options of 3V and 3.3V offer flexibility in power management, catering to different system requirements.

No. of Terminals: 24

Having 24 terminals allows for multiple connections and functionality, making the product versatile in its applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable board space, enabling the integration of other components in a compact design.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage requirement ensures efficient power consumption and operation in low-power scenarios, enhancing energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows the product to withstand elevated temperatures, ensuring reliable performance in challenging environments.

CPU Family: LVT

Belonging to the LVT CPU family indicates optimized performance and compatibility with low-voltage logic circuits, providing efficient processing capabilities.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature enables the product to function in extreme cold conditions, suitable for various industrial and harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finish ensures reliable and corrosion-resistant connections, enhancing the product's durability and longevity.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in board layout and component placement, optimizing signal routing and improving overall system performance.

Maximum Seated Height: 2.65 mm

The low maximum seated height simplifies the design of compact and thin devices, allowing for slim and sleek product profiles.

Width: 7.5 mm

The compact width dimension facilitates efficient board layout and integration within confined spaces, ideal for space-constrained applications.

External Data Bus Width: 8

The 8-bit external data bus width enables efficient data transfer and processing, enhancing the product's performance in data-intensive tasks.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering during assembly processes, contributing to the product's overall quality and durability.

Length: 15.4 mm

The moderate length dimension offers a balance between board space utilization and component placement flexibility, facilitating versatile design implementations.

Temperature Grade: INDUSTRIAL

Being designated as an industrial temperature grade signifies robustness and reliability in harsh operating conditions, making the product suitable for industrial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Having a microprocessor circuit as the peripheral IC type indicates advanced processing capabilities and functionality, allowing for complex computing tasks and system integration.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability in various electronic applications.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable solder connections, providing mechanical strength and electrical stability during operation.

Maximum Supply Current: 7 mA

The low maximum supply current requirement indicates efficient power usage and minimal energy wastage, contributing to the product's energy efficiency and reliability.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V aligns with standard power requirements, ensuring compatibility with a wide range of power sources and devices.

Terminal Pitch: 1.27 mm

The narrow terminal pitch allows for high-density mounting and space-efficient design, enabling compact and miniaturized electronic devices.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs SN74LVT8980ADWRG4 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

CPU Family:

LVT

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Microprocessor ICs

Maximum Supply Current:

7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

SN74LVT8980ADWRG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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