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SN74LVT573DWR

Texas Instruments

SN74LVT573DWR by Texas Instruments

SN74LVT573DWR by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.3 ns and operates at a nominal voltage of 3.3V. It features a small outline package style, suitable for industrial applications requiring fast signal transmission in tight spaces.

Median Price

$1.150

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 303 parts In-Stock

1+ parts

-

100+ parts

$1.150

1k+ parts

$0.955

10k+ parts

$0.851

303

-

$1.150

$0.955

$0.851

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,277 parts In-Stock

1+ parts

$0.896

100+ parts

-

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2,277

$0.896

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Vyrian

USA . 6,387 parts In-Stock

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6,387

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Chip Stock

USA . 3,120 parts In-Stock

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Velocity Electronics

USA . 1,885 parts In-Stock

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1,885

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Lighthouse Electronics, Inc.

USA . 1,622 parts In-Stock

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1,622

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North Shore Components

USA . 8 parts In-Stock

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8

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Distributors (Availability)

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Corphita

USA . 3,527 parts In-Stock

1+ parts

$0.849

100+ parts

-

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3,527

$0.849

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Component Stockers USA

USA . 329 parts In-Stock

1+ parts

$0.980

100+ parts

$0.920

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-

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329

$0.980

$0.920

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Andel Nordic

Denmark . 3,868 parts In-Stock

1+ parts

$7.692

100+ parts

-

1k+ parts

$7.385

10k+ parts

$7.385

3,868

$7.692

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$7.385

$7.385

AZTECH Wire

Italy . 1,048 parts In-Stock

1+ parts

$17.650

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1,048

$17.650

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Parana Technologies

USA . 604 parts In-Stock

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$22.058

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$22.631

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604

$22.058

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$22.631

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DigiPath Technology Company

USA . 1,056 parts In-Stock

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$24.288

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1,056

$24.288

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ChromeModa Solutions

Germany . 6,358 parts In-Stock

1+ parts

$24.784

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$20.323

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6,358

$24.784

$20.323

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IDEA Electronic Components Group

UK . 938 parts In-Stock

1+ parts

$24.784

100+ parts

$23.545

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$22.306

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938

$24.784

$23.545

$22.306

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Microchip USA

USA . 5,231 parts In-Stock

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Perfect Parts

USA . 961 parts In-Stock

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Overview

Enhance your electronic projects with the Texas Instruments SN74LVT573DWR Bus Driver & Transceiver. Known for their superior quality and reliability, Texas Instruments products are trusted by professionals worldwide. The SN74LVT573DWR offers 8 bits of seamless data transmission with a fast propagation delay of 4.3 ns, making it ideal for high-speed applications. With a small outline package style and a wide temperature grade range, this versatile component is perfect for industrial environments. Trust Texas Instruments to deliver top-notch performance and durability in every product they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Propagation Delay At Nominal Supply: 4.3 ns

The low propagation delay ensures quick signal transmission, making it suitable for high-speed data communication.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard form factor for easy integration into existing designs.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is a common standard in electronics, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

The load capacitance of 50pF ensures stable signal transmission and reception, improving overall performance.

No. of Bits: 8

Having 8 bits allows for a sufficient range of data transmission, suitable for various applications requiring binary data.

Power Supplies (V): 3.3

The use of a 3.3V power supply simplifies power management and ensures compatibility with modern electronic systems.

Maximum I (ol): 64 Amp

The high maximum output current of 64A enables driving of heavy loads without the risk of damaging the device.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate logic operation, providing flexibility in controlling the output signal.

Technical Specifications

Bus Driver & Transceivers SN74LVT573DWR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

BROADSIDE VERSION OF 373

Family:

LVT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

12 mA

Propagation Delay At Nominal Supply:

4.3 ns

Propagation Delay (tpd):

7.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74LVT573DWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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