Loading...

SN74LVT18502PM

Texas Instruments

SN74LVT18502PM by Texas Instruments

SN74LVT18502PM by Texas Instruments is a 9-bit bus driver with 7.4 ns propagation delay, suitable for industrial applications. It operates at a supply voltage of 3.3V and features 3-STATE output characteristics. With a low profile flatpack package style, it offers independent control and bidirectional count direction.

Median Price

$10.688

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 105 parts In-Stock

1+ parts

-

100+ parts

$8.550

1k+ parts

$7.650

10k+ parts

$7.200

105

-

$8.550

$7.650

$7.200

DigiKey

USA . 105 parts In-Stock

1+ parts

-

100+ parts

$11.250

1k+ parts

-

10k+ parts

-

105

-

$11.250

-

-

Verical

USA . 68 parts In-Stock

1+ parts

-

100+ parts

$10.688

1k+ parts

$9.563

10k+ parts

$9.000

68

-

$10.688

$9.563

$9.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,452 parts In-Stock

1+ parts

$9.025

100+ parts

-

1k+ parts

-

10k+ parts

-

4,452

$9.025

-

-

-

Vyrian

USA . 7,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,920

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,332 parts In-Stock

1+ parts

$8.550

100+ parts

-

1k+ parts

-

10k+ parts

-

1,332

$8.550

-

-

-

Parana Technologies

USA . 2,317 parts In-Stock

1+ parts

$28.578

100+ parts

-

1k+ parts

$49.099

10k+ parts

-

2,317

$28.578

-

$49.099

-

ChromeModa Solutions

Germany . 6,251 parts In-Stock

1+ parts

$32.110

100+ parts

$26.330

1k+ parts

-

10k+ parts

-

6,251

$32.110

$26.330

-

-

IDEA Electronic Components Group

UK . 93 parts In-Stock

1+ parts

$32.110

100+ parts

$30.504

1k+ parts

$28.899

10k+ parts

-

93

$32.110

$30.504

$28.899

-

Andel Nordic

Denmark . 2,874 parts In-Stock

1+ parts

$64.575

100+ parts

-

1k+ parts

$61.992

10k+ parts

$61.992

2,874

$64.575

-

$61.992

$61.992

DigiPath Technology Company

USA . 174 parts In-Stock

1+ parts

-

100+ parts

$28.950

1k+ parts

-

10k+ parts

-

174

-

$28.950

-

-

Kepictronics

USA . 84 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

84

-

-

-

-

Overview

Enhance your electronic designs with the cutting-edge SN74LVT18502PM by Texas Instruments. Designed with precision and reliability in mind, this bus driver and transceiver offers seamless integration and high performance across a variety of applications. With Texas Instruments' reputation for quality and innovation backing it up, this product provides exceptional value and benefits to customers looking for top-notch solutions. Upgrade your projects and experience the advantages of the SN74LVT18502PM today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the product, ensuring a longer lifespan and resistance to environmental factors.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay ensures quick and efficient data transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and reducing assembly complexity.

No. of Functions: 2

Having multiple functions in a single device increases versatility and functionality, making the product a cost-effective solution for different applications.

Package Shape: SQUARE

The square package shape provides a compact design that facilitates easy placement and integration within tight spaces on a PCB.

No. of Bits: 9

Having a larger number of bits allows for a higher level of data processing and handling capability, making the product suitable for complex communication scenarios.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a common voltage of 3.3V ensures compatibility with standard power sources and other components in the system.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures stable signal transmission and reception, reducing the risk of signal distortion or loss.

Power Supplies (V): 3.3

Consistent power supply voltage of 3.3V ensures reliable and efficient operation of the product.

No. of Terminals: 64

Having a higher number of terminals allows for more connectivity options and configurations, increasing the product's versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers easy integration and space-saving benefits, making the product ideal for compact designs.

Maximum I (ol): 32 Amp

A high maximum output current of 32 Amps allows the product to drive larger loads or multiple devices simultaneously, expanding its application range.

Propagation Delay (tpd): 7.4 ns

Low propagation delay of 7.4 ns ensures fast and efficient data transmission, reducing latency and improving system performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperatures in industrial environments, ensuring reliable operation.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow for high impedance output state when not actively driving the bus, reducing power consumption and signal interference.

Trigger Type: POSITIVE EDGE

Positive edge trigger type facilitates accurate and synchronized data transmission, ensuring data integrity and reliability.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, the product can withstand extreme cold conditions, making it suitable for outdoor and rugged environments.

Terminal Position: QUAD

Quad terminal position enhances connectivity options and allows for flexible PCB layout configurations, enhancing overall system design flexibility.

No. of Ports: 2

Having two ports provides multiple connection options and simultaneous data transmission capabilities, making the product suitable for bus communication applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm allows for compact and slim designs, suitable for space-constrained applications.

Width: 10 mm

Compact width of 10 mm enables easy integration into tight spaces on a PCB, optimizing board space utilization.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and reception, preventing signal inversion and ensuring data integrity.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage of 2.7V allows for operation in low-power scenarios, increasing energy efficiency and compatibility with various power sources.

Length: 10 mm

Compact length of 10 mm enables space-saving installation and integration within small devices or crowded PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments with wide temperature fluctuations, making the product suitable for industrial applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation, low power consumption, and robust performance.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections on the PCB, ensuring durability and longevity of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables precise and compact PCB layout designs, optimizing signal integrity and reducing signal crosstalk.

Count Direction: BIDIRECTIONAL

Bidirectional count direction allows for data transmission in both directions on the bus, enhancing communication flexibility and efficiency.

Control Type: INDEPENDENT CONTROL

Independent control capability enables separate operation and manipulation of each function within the product, providing customization and flexibility in system control.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage of 3.6V ensures compatibility with a wide range of power sources and systems, increasing the product's versatility.

Maximum Power Supply Current (ICC): 15 mA

Low maximum power supply current of 15 mA reduces power consumption and heat generation, contributing to energy efficiency and overall system reliability.

Technical Specifications

Bus Driver & Transceivers SN74LVT18502PM attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

32 Amp

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

15 mA

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

7.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

10 mm

Trade Compliance

SN74LVT18502PM Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20