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SN74LVCH16T245KR

Texas Instruments

SN74LVCH16T245KR by Texas Instruments

SN74LVCH16T245KR by Texas Instruments is a 2-function bus driver with 8 bits, operating at 1.8V nominal voltage. It features a propagation delay of 23.8ns and supports translation b/w 1.8V and 5V, making it ideal for bidirectional applications in industrial settings requiring common control functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,773 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,773

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Vyrian

USA . 3,776 parts In-Stock

1+ parts

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100+ parts

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3,776

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 604 parts In-Stock

1+ parts

$5.815

100+ parts

-

1k+ parts

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604

$5.815

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Andel Nordic

Denmark . 1,871 parts In-Stock

1+ parts

$7.880

100+ parts

-

1k+ parts

$5.513

10k+ parts

$5.513

1,871

$7.880

-

$5.513

$5.513

Parana Technologies

USA . 958 parts In-Stock

1+ parts

$25.013

100+ parts

-

1k+ parts

$25.701

10k+ parts

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958

$25.013

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$25.701

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DigiPath Technology Company

USA . 1,590 parts In-Stock

1+ parts

$27.543

100+ parts

$25.339

1k+ parts

-

10k+ parts

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1,590

$27.543

$25.339

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ChromeModa Solutions

Germany . 2,093 parts In-Stock

1+ parts

$28.105

100+ parts

$23.046

1k+ parts

-

10k+ parts

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2,093

$28.105

$23.046

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IDEA Electronic Components Group

UK . 906 parts In-Stock

1+ parts

$28.105

100+ parts

$26.700

1k+ parts

$25.294

10k+ parts

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906

$28.105

$26.700

$25.294

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One Stop Electronics

USA . 1,073 parts In-Stock

1+ parts

$54.000

100+ parts

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1,073

$54.000

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Corphita

USA . 3,092 parts In-Stock

1+ parts

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3,092

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Microchip USA

USA . 467 parts In-Stock

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467

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Overview

Upgrade your electronic designs with the SN74LVCH16T245KR from Texas Instruments, a top-tier manufacturer known for producing high-quality bus drivers and transceivers. This versatile component offers customers value, benefits, and advantages in various applications, thanks to its reliable performance and efficient data transmission capabilities. Whether you're working on industrial automation, telecommunications, or consumer electronics, this product's exceptional features and characteristics make it a must-have for your projects. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package ensures product longevity and ease of handling during installation.

Propagation Delay At Nominal Supply: 23.8 ns

Low propagation delay ensures fast and efficient signal transmission, ideal for high-speed communication applications.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on PCBs, saving space and simplifying assembly process.

No. of Functions: 2

Having multiple functions in a single component reduces the overall component count on the PCB, leading to cost savings and improved reliability.

Package Shape: RECTANGULAR

Rectangular shape facilitates compact and efficient PCB layout designs, optimizing space utilization within the system.

No. of Bits: 8

8-bit capability enables the device to process and control a wide range of data signals, making it versatile and suitable for diverse applications.

Translation: 1.8/5V&1.8/5V

Support for dual voltage translation allows seamless interfacing between different voltage levels, enhancing compatibility with various systems.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy-efficient and suitable for battery-powered applications.

Load Capacitance (CL): 15 pF

Optimized load capacitance ensures stable and reliable signal transmission, reducing signal distortion and improving overall performance.

Power Supplies (V): 1.8/5

Support for multiple power supplies enables flexible power management options, enhancing system reliability and efficiency.

No. of Terminals: 56

Abundance of terminals allows for versatile connectivity options, enabling easy integration into complex system architectures.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Innovative package style with fine pitch design minimizes footprint on the PCB, enabling high-density integration in space-constrained applications.

Maximum I (ol): 32 Amp

High output current capability supports robust signal driving capabilities, ensuring reliable operation even under heavy load conditions.

Propagation Delay (tpd): 23.8 ns

Low propagation delay ensures minimal signal latency, facilitating quick data transfer and response times in communication systems.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in harsh environmental conditions, enhancing product durability and versatility.

Output Characteristics: 3-STATE

3-state output configuration offers flexibility in signal control and data transmission, enabling efficient bus management in multi-device communication systems.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable operation in extreme cold conditions, suitable for industrial and outdoor applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides excellent solderability and reliability in PCB assembly processes, ensuring secure connection and long-term functionality.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, enabling easy access and secure mounting within the system.

No. of Ports: 2

Dual port configuration allows for simultaneous data transmission and reception, enhancing system efficiency and enabling bidirectional communication.

Maximum Seated Height: 1 mm

Low profile design with minimal seated height allows for compact and space-saving integration in slim electronic devices and modules.

Width: 4.5 mm

Narrow width dimension enables efficient board space utilization, facilitating compact and streamlined PCB designs in tight layout constraints.

Output Polarity: TRUE

True output polarity ensures accurate signal representation and processing, minimizing errors and enhancing system reliability in data transmission.

Minimum Supply Voltage (Vsup): 1.65 V

Support for low minimum supply voltage allows for operation in low-power scenarios, suitable for energy-efficient and battery-powered applications.

Peak Reflow Temperature °C: 240

High peak reflow temperature tolerance ensures reliable solder reflow process during PCB assembly, guaranteeing secure and stable terminal connections.

Length: 7 mm

Compact length dimension enables space-efficient integration in electronic systems, supporting sleek and miniaturized product designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments, suitable for rugged applications and extended service life.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable in signal processing.

Terminal Form: BALL

Ball terminal form offers secure and reliable electrical connections, ensuring stable signal transmission and robust mechanical strength in challenging operating conditions.

Packing Method: TR

Tray packing method ensures safe handling and storage during transportation, protecting the product from damage and ensuring product quality upon delivery.

Terminal Pitch: 0.65 mm

Fine terminal pitch enables high-density mounting on PCBs, optimizing board space utilization and supporting compact system designs in space-constrained applications.

Count Direction: BIDIRECTIONAL

Bidirectional count direction allows for versatile data input and output operations, supporting flexible data exchange and communication protocols in diverse applications.

Control Type: COMMON CONTROL

Common control mechanism simplifies interface management and system operation, enhancing user convenience and system efficiency in controlling multiple functions.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance ensures compatibility with a wide range of power sources, offering versatility and reliability in varying operating conditions.

Maximum Power Supply Current (ICC): 0.03 mA

Low power supply current consumption minimizes energy usage and heat dissipation, contributing to energy efficiency and prolonged battery life in portable applications.

Technical Specifications

Bus Driver & Transceivers SN74LVCH16T245KR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e0

Length:

7 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

240

Power Supplies (V):

1.8/5

Maximum Power Supply Current (ICC):

.03 mA

Propagation Delay At Nominal Supply:

23.8 ns

Propagation Delay (tpd):

23.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Translation:

1.8/5V&1.8/5V

Width:

4.5 mm

Trade Compliance

SN74LVCH16T245KR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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