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SN74LVCH16652ADLR

Texas Instruments

SN74LVCH16652ADLR by Texas Instruments

SN74LVCH16652ADLR by Texas Instruments is a bus driver with 8 bits, 2 functions, and 3-state output. It operates at a supply voltage of 1.8V to 3.6V, with propagation delay of 6.3ns and max I (ol) of 24Amp. Ideal for bidirectional communication in industrial applications due to its compact size and independent control feature.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,677 parts In-Stock

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Digiode

USA . 752 parts In-Stock

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752

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AZTECH Wire

Italy . 637 parts In-Stock

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$15.346

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637

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Parana Technologies

USA . 35 parts In-Stock

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$18.548

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$18.654

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35

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DigiPath Technology Company

USA . 1,913 parts In-Stock

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$20.423

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$20.423

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ChromeModa Solutions

Germany . 2,803 parts In-Stock

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$20.840

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$17.089

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2,803

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$17.089

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IDEA Electronic Components Group

UK . 702 parts In-Stock

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$20.840

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$19.798

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$18.756

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702

$20.840

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$18.756

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One Stop Electronics

USA . 1,558 parts In-Stock

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$60.000

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Andel Nordic

Denmark . 3,980 parts In-Stock

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Corphita

USA . 3,919 parts In-Stock

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Microchip USA

USA . 324 parts In-Stock

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Overview

Elevate your electronics with the SN74LVCH16652ADLR by Texas Instruments, a top-tier manufacturer known for excellence in bus drivers & transceivers. This high-quality product offers customers unparalleled value with its reliable performance and versatile applications. Say goodbye to slow data transmission and hello to seamless connectivity with the SN74LVCH16652ADLR – the perfect solution for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for use in portable devices.

Propagation Delay At Nominal Supply: 6.3 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards and saves space in the overall design.

No. of Functions: 2

Having multiple functions in a single component simplifies the circuit design and reduces the number of components needed.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage requirement helps in reducing power consumption and is compatible with a wide range of devices.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product can be used in harsh environmental conditions without compromising performance.

Output Characteristics: 3-STATE

The 3-state output allows for high flexibility in controlling the output signals, making it versatile for different types of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LVCH16652ADLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G56

Length:

18.415 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Propagation Delay (tpd):

7.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.79 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.49 mm

Trade Compliance

SN74LVCH16652ADLR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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