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SN74LVC574AQDWREP

Texas Instruments

SN74LVC574AQDWREP by Texas Instruments

SN74LVC574AQDWREP by Texas Instruments is an 8-bit bus driver with a propagation delay of 7ns and operates at a supply voltage of 3.3V. It features a 3-STATE output, positive edge trigger type, and is suitable for automotive applications due to its temperature grade.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,164 parts In-Stock

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Digiode

USA . 4,557 parts In-Stock

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4,557

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Distributors (Availability)

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Andel Nordic

Denmark . 780 parts In-Stock

1+ parts

$7.895

100+ parts

-

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$7.579

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$7.579

780

$7.895

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$7.579

$7.579

One Stop Electronics

USA . 816 parts In-Stock

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$10.000

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816

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Parana Technologies

USA . 1,664 parts In-Stock

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$14.661

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$15.100

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$14.661

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$15.100

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ChromeModa Solutions

Germany . 6,045 parts In-Stock

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$16.473

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$13.508

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6,045

$16.473

$13.508

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IDEA Electronic Components Group

UK . 213 parts In-Stock

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$16.473

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$15.649

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$14.826

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213

$16.473

$15.649

$14.826

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AZTECH Wire

Italy . 209 parts In-Stock

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$18.270

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Corphita

USA . 2,072 parts In-Stock

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DigiPath Technology Company

USA . 368 parts In-Stock

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$14.852

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Microchip USA

USA . 207 parts In-Stock

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Overview

Enhance the performance and reliability of your electronic devices with the SN74LVC574AQDWREP by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers seamless communication between different components, ensuring smooth operation. Ideal for automotive applications, this product boasts a compact design and high-quality materials, making it a valuable addition to any project. Trust Texas Instruments for top-notch technology that delivers exceptional results every time. Elevate your designs with the SN74LVC574AQDWREP and experience unparalleled efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and insulation, making the product resistant to external elements and ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay ensures quick signal transmission, making this product suitable for high-speed bus communication.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

No. of Bits: 8

Suitable for handling data transmission in bus systems that require 8-bit information handling.

Nominal Supply Voltage / Vsup (V): 2.7

Operates efficiently at a low voltage, saving power and making it suitable for battery-powered applications.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission, reducing the risk of errors in data communication.

Maximum Frequency At Nominal Supply: 150000000 Hz

High maximum frequency capability is ideal for applications requiring fast data transfer rates.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers SN74LVC574AQDWREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

SN74LVC574AQDWREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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