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SN74LVC573APWG4

Texas Instruments

SN74LVC573APWG4 by Texas Instruments

SN74LVC573APWG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 6.9 ns at 3.3V, suitable for automotive applications. It features a max operating temperature of 125°C, output polarity TRUE, and a terminal pitch of 0.65 mm in a small outline package.

Median Price

$0.842

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.440

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$0.440

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Digiode

USA . 4,877 parts In-Stock

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$1.244

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Vyrian

USA . 5,391 parts In-Stock

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A&K Electronics

USA . 54 parts In-Stock

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Rotakorn

Sweden . 54 parts In-Stock

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Bristol Electronics

USA . 54 parts In-Stock

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Distributors (Availability)

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.440

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$0.440

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Corphita

USA . 619 parts In-Stock

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$1.179

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619

$1.179

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Ampacity Inc.

Singapore . 14 parts In-Stock

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$1.670

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$1.670

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Parana Technologies

USA . 678 parts In-Stock

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$10.483

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$10.994

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IDEA Electronic Components Group

UK . 1,389 parts In-Stock

1+ parts

$11.779

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$11.190

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$10.601

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1,389

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$10.601

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ChromeModa Solutions

Germany . 689 parts In-Stock

1+ parts

$11.779

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$9.659

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$9.659

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AZTECH Wire

Italy . 618 parts In-Stock

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$16.118

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618

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Advanced Electronics

New Zealand . 3,131 parts In-Stock

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$26.105

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$25.844

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$24.800

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3,131

$26.105

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Andel Nordic

Denmark . 696 parts In-Stock

1+ parts

$721.114

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$692.269

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$692.269

696

$721.114

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$692.269

$692.269

Microchip USA

USA . 2,610 parts In-Stock

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DigiPath Technology Company

USA . 620 parts In-Stock

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Perfect Parts

USA . 67 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LVC573APWG4 by Texas Instruments, a top-quality Bus Driver & Transceiver that offers reliable performance and durability. Texas Instruments is known for its innovative technology and exceptional manufacturing standards, ensuring that this product meets the highest industry benchmarks. With a wide range of applications in various electronic devices, this product provides customers with exceptional value, efficiency, and seamless integration. Upgrade your projects with the SN74LVC573APWG4 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 6.9 ns

With a low propagation delay, this product ensures efficient data transmission and fast response times.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making it convenient for integration into different systems.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact form factor, making it suitable for installations with space constraints.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data processing tasks effectively.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V, this product ensures stable and reliable performance.

Load Capacitance (CL): 50 pF

The 50pF load capacitance helps in maintaining signal integrity and preventing distortion during data transmission.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of systems and devices.

No. of Terminals: 20

With 20 terminals, this product offers flexibility in connectivity options for different setups.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch design of the package make it suitable for compact installations and high-density applications.

Technical Specifications

Bus Driver & Transceivers SN74LVC573APWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.9 ns

Propagation Delay (tpd):

22.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LVC573APWG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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