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SN74LVC3G07DCTRG4

Texas Instruments

SN74LVC3G07DCTRG4 by Texas Instruments

SN74LVC3G07DCTRG4 by Texas Instruments is a logic gate with 3 functions and 1 input. It has a propagation delay of 3.7 ns and operates at a nominal voltage of 1.8V. This device is commonly used in automotive applications due to its small size, low profile, and high temperature tolerance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,428 parts In-Stock

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Vyrian

USA . 1,900 parts In-Stock

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1,900

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Nova Conductors

Japan . 75 parts In-Stock

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75

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Distributors (Availability)

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Parana Technologies

USA . 1,688 parts In-Stock

1+ parts

$7.495

100+ parts

-

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$7.990

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$7.495

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$7.990

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ChromeModa Solutions

Germany . 3,586 parts In-Stock

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$8.421

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$6.905

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$6.905

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IDEA Electronic Components Group

UK . 1,988 parts In-Stock

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$8.421

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$8.000

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$7.579

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$8.421

$8.000

$7.579

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AZTECH Wire

Italy . 750 parts In-Stock

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$17.926

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$17.926

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One Stop Electronics

USA . 1,333 parts In-Stock

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$29.000

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Corohmni

South Africa . 1,074 parts In-Stock

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$33.748

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$33.748

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Ampacity Inc.

Singapore . 1,377 parts In-Stock

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$65.000

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Continental Prestige Electronics

USA . 4,935 parts In-Stock

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Corphita

USA . 3,431 parts In-Stock

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Microchip USA

USA . 2,604 parts In-Stock

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Argo Parts USA

USA . 821 parts In-Stock

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DigiPath Technology Company

USA . 448 parts In-Stock

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$7.592

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Texas Instruments, a renowned manufacturer in the electronics industry, presents the SN74LVC3G07DCTRG4 Logic Gates. This high-quality product offers exceptional value to customers with its advanced features and benefits. Designed for various applications, this Logic Gates category device delivers reliable performance and precise functionality. With Texas Instruments' expertise, customers can trust in the superior quality and durability of this product. Experience seamless integration, enhanced efficiency, and amplified productivity with the SN74LVC3G07DCTRG4 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, ensuring reliability even in demanding environments.

Propagation Delay At Nominal Supply: 3.7 ns

Allows for fast and efficient processing of signals, minimizing latency in data transmission.

Surface Mount: YES

Enables easy installation and integration onto circuit boards, saving time and effort in the assembly process.

No. of Functions: 3

Incorporates multiple logic functions within a single component, reducing the need for additional discrete components and optimizing space utilization.

No. of Inputs: 1

Offers versatile functionality for various applications, allowing input from different sources or sensors.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently with a low supply voltage, reducing power consumption and improving energy efficiency.

Load Capacitance (CL): 50 pF

Handles high capacitance loads effectively, ensuring stable and accurate output signals.

Output Characteristics: OPEN-DRAIN

Facilitates flexible output connections and compatibility with a wide range of devices, enhancing versatility and compatibility.

Technology: CMOS

Utilizes advanced CMOS technology that provides low power consumption, high noise immunity, and compatibility within modern digital systems.

Maximum Supply Voltage (Vsup): 5.5 V

Withstands high voltage inputs, offering robustness and protection against voltage surges or fluctuations.

Maximum Operating Temperature: 125 °C

Functions reliably in high-temperature environments, making it ideal for automotive or industrial applications.

Technical Specifications

Logic Gates SN74LVC3G07DCTRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.95 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Inputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.7 ns

Propagation Delay (tpd):

7.8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.3 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.8 mm

Trade Compliance

SN74LVC3G07DCTRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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