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SN74LVC1G3208DCKT

Texas Instruments

SN74LVC1G3208DCKT by Texas Instruments

SN74LVC1G3208DCKT by Texas Instruments is a logic gate with 3 inputs, 5.9 ns propagation delay, and 1.8V nominal voltage. It is used in automotive applications due to its small outline package style and CMOS technology, operating b/w -40°C to 125°C temperature range.

Median Price

$0.730

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 165 parts In-Stock

1+ parts

$0.561

100+ parts

$0.314

1k+ parts

$0.229

10k+ parts

$0.204

165

$0.561

$0.314

$0.229

$0.204

Texas Instruments

USA . 297,560 parts In-Stock

1+ parts

$0.749

100+ parts

$0.509

1k+ parts

$0.261

10k+ parts

-

297,560

$0.749

$0.509

$0.261

-

Rochester

USA . 41,728 parts In-Stock

1+ parts

-

100+ parts

$0.717

1k+ parts

$0.595

10k+ parts

$0.530

41,728

-

$0.717

$0.595

$0.530

DigiKey

USA . 41,728 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.900

10k+ parts

-

41,728

-

-

$0.900

-

Verical

USA . 41,428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.743

10k+ parts

$0.663

41,428

-

-

$0.743

$0.663

Avnet

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.297

500

-

-

-

$0.297

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,312 parts In-Stock

1+ parts

$0.344

100+ parts

-

1k+ parts

-

10k+ parts

-

2,312

$0.344

-

-

-

TME

Poland . 42 parts In-Stock

1+ parts

$0.670

100+ parts

$0.596

1k+ parts

-

10k+ parts

-

42

$0.670

$0.596

-

-

Chip Stock

USA . 27,502 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,502

-

-

-

-

Vyrian

USA . 2,539 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,539

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,825 parts In-Stock

1+ parts

$0.326

100+ parts

-

1k+ parts

-

10k+ parts

-

2,825

$0.326

-

-

-

Microchip USA

USA . 4,720 parts In-Stock

1+ parts

$3.757

100+ parts

-

1k+ parts

-

10k+ parts

-

4,720

$3.757

-

-

-

Parana Technologies

USA . 441 parts In-Stock

1+ parts

$19.340

100+ parts

-

1k+ parts

$19.358

10k+ parts

-

441

$19.340

-

$19.358

-

DigiPath Technology Company

USA . 2,155 parts In-Stock

1+ parts

$21.295

100+ parts

$19.592

1k+ parts

-

10k+ parts

-

2,155

$21.295

$19.592

-

-

ChromeModa Solutions

Germany . 4,372 parts In-Stock

1+ parts

$21.730

100+ parts

$17.819

1k+ parts

-

10k+ parts

-

4,372

$21.730

$17.819

-

-

IDEA Electronic Components Group

UK . 506 parts In-Stock

1+ parts

$21.730

100+ parts

$20.644

1k+ parts

$19.557

10k+ parts

-

506

$21.730

$20.644

$19.557

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Perfect Parts

USA . 2,946 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,946

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Overview

Enhance your electronic projects with the SN74LVC1G3208DCKT by Texas Instruments, a top-quality logic gate that boasts precision engineering and reliability. Designed for various applications, this compact component offers seamless integration and efficient performance. With Texas Instruments' reputation for innovation and excellence, you can trust that the SN74LVC1G3208DCKT delivers unmatched value and benefits to meet your needs. Upgrade your circuits today and experience the advantages of using this superior product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 5.9 ns

The low propagation delay ensures fast signal processing, making this logic gate suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage requirement makes this logic gate suitable for low-power applications, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this logic gate to withstand harsh environmental conditions, making it suitable for industrial and automotive applications.

Technical Specifications

Logic Gates SN74LVC1G3208DCKT attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

3

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.25 mm

Trade Compliance

SN74LVC1G3208DCKT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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