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SN74LVC16374AZRDR

Texas Instruments

SN74LVC16374AZRDR by Texas Instruments

SN74LVC16374AZRDR by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.5 ns and operates at a max frequency of 150 MHz. It features a true output polarity, positive edge trigger type, and is ideal for automotive applications due to its thin profile package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,685 parts In-Stock

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Vyrian

USA . 2,935 parts In-Stock

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Component Sense

UK . 1,693 parts In-Stock

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1,693

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Distributors (Availability)

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Andel Nordic

Denmark . 478 parts In-Stock

1+ parts

$3.912

100+ parts

-

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$3.756

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$3.756

478

$3.912

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$3.756

$3.756

AZTECH Wire

Italy . 898 parts In-Stock

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$13.620

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898

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Parana Technologies

USA . 1,876 parts In-Stock

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$25.537

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$2,371.476

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$22.983

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1,876

$25.537

$2,371.476

$22.983

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DigiPath Technology Company

USA . 1,956 parts In-Stock

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$28.119

100+ parts

$25.870

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$28.119

$25.870

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ChromeModa Solutions

Germany . 2,648 parts In-Stock

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$28.693

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$23.528

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$28.693

$23.528

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IDEA Electronic Components Group

UK . 1,377 parts In-Stock

1+ parts

$28.693

100+ parts

$27.258

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$25.824

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1,377

$28.693

$27.258

$25.824

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One Stop Electronics

USA . 1,400 parts In-Stock

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$61.000

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Corphita

USA . 1,291 parts In-Stock

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Kepictronics

USA . 700 parts In-Stock

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700

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A-Z Elektronik GmbH

Germany . 700 parts In-Stock

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700

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Microchip USA

USA . 297 parts In-Stock

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Overview

Enhance your electronic projects with the Texas Instruments SN74LVC16374AZRDR, a high-quality Bus Driver & Transceiver that offers reliable performance and versatility. With a reputable manufacturer like Texas Instruments behind it, you can trust in the durability and innovation of this product. Perfect for a wide range of applications, this 8-bit transceiver provides seamless data transmission while maintaining low power consumption. Experience the value and benefits of this product as it delivers fast propagation delays, 3-state output characteristics, and a wide operating temperature range. Upgrade your designs with the SN74LVC16374AZRDR and unlock endless possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for automotive applications

Propagation Delay At Nominal Supply: 4.5 ns

Fast signal propagation ensures efficient communication within the system

Surface Mount: YES

Easy to mount on PCBs, saving space and reducing assembly time

Nominal Supply Voltage / Vsup (V): 1.8

Low power consumption and compatible with various supply voltages

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

Compact and space-saving design for densely packed electronic systems

Maximum Operating Temperature: 125 °C

Suitable for automotive applications with high operating temperatures

Technology: CMOS

Low power consumption and high noise immunity for reliable operation

Technical Specifications

Bus Driver & Transceivers SN74LVC16374AZRDR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B54

JESD-609 Code:

e1

Length:

8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

54

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA54,6X9,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

5.5 mm

Trade Compliance

SN74LVC16374AZRDR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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