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SN74LVC16374AZQLR

Texas Instruments

SN74LVC16374AZQLR by Texas Instruments

SN74LVC16374AZQLR by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.5 ns and operates at a max frequency of 150 MHz. It features a supply voltage of 1.8V, output polarity is true, and has independent control for various applications in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,651 parts In-Stock

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Digiode

USA . 3,183 parts In-Stock

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3,183

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Bristol Electronics

USA . 645 parts In-Stock

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645

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Dan-Mar Components

USA . 645 parts In-Stock

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645

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Distributors (Availability)

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Andel Nordic

Denmark . 3,225 parts In-Stock

1+ parts

$5.378

100+ parts

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$5.163

10k+ parts

$5.163

3,225

$5.378

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$5.163

$5.163

AZTECH Wire

Italy . 574 parts In-Stock

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$11.302

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574

$11.302

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Parana Technologies

USA . 1,452 parts In-Stock

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$18.000

100+ parts

$1,671.596

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$16.200

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1,452

$18.000

$1,671.596

$16.200

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DigiPath Technology Company

USA . 1,666 parts In-Stock

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$19.820

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$19.820

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IDEA Electronic Components Group

UK . 282 parts In-Stock

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$20.225

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$19.214

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$18.202

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282

$20.225

$19.214

$18.202

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ChromeModa Solutions

Germany . 83 parts In-Stock

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$20.225

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$16.584

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83

$20.225

$16.584

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One Stop Electronics

USA . 1,449 parts In-Stock

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$33.000

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$33.000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Corphita

USA . 1,879 parts In-Stock

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Kepictronics

USA . 780 parts In-Stock

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780

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Microchip USA

USA . 330 parts In-Stock

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330

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Overview

Enhance your electronic designs with the SN74LVC16374AZQLR by Texas Instruments, a top-tier manufacturer known for reliable and high-quality products. This bus driver & transceiver is perfect for various applications, offering fast propagation delay, low power consumption, and 3-state output characteristics. With its advanced technology and industrial-grade temperature tolerance, this component provides exceptional value and performance, making it an essential choice for demanding projects. Trust Texas Instruments to deliver excellence in every aspect of your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and thermal stability for reliable performance in various operating conditions.

Propagation Delay At Nominal Supply: 4.5 ns

Low propagation delay ensures fast and efficient signal transmission.

Surface Mount: YES

Allows for easy and compact integration onto circuit boards.

No. of Functions: 2

Offers multiple functions in a single component for enhanced functionality.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low supply voltage, reducing power consumption.

Load Capacitance (CL): 50 pF

Suitable for driving a variety of loads with capacitive characteristics.

Power Supplies (V): 3.3

Compatible with common power supply voltages for ease of integration.

No. of Terminals: 56

Provides multiple connection points for versatile connectivity options.

Maximum I (ol): 24 Amp

Capable of driving higher current loads for robust performance.

Propagation Delay (tpd): 6.5 ns

Low propagation delay ensures fast signal processing and communication.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments without performance degradation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Maximum Supply Voltage (Vsup): 3.6 V

Wide supply voltage range allows for flexibility in power supply design.

Technical Specifications

Bus Driver & Transceivers SN74LVC16374AZQLR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

4.5 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

4.5 mm

Trade Compliance

SN74LVC16374AZQLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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