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SN74LV373APWT

Texas Instruments

SN74LV373APWT by Texas Instruments

SN74LV373APWT by Texas Instruments is an 8-bit bus driver with a propagation delay of 17 ns at 2.5V, suitable for automotive applications. It features a 3-STATE output and operates within a temperature range of -40 to 125°C. With surface mount capability and a small outline package style, it offers efficient performance in various electronic systems.

Median Price

$0.715

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 173 parts In-Stock

1+ parts

$0.850

100+ parts

$0.595

1k+ parts

-

10k+ parts

-

173

$0.850

$0.595

-

-

Rochester

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

$0.689

1k+ parts

$0.572

10k+ parts

$0.510

1,500

-

$0.689

$0.572

$0.510

Verical

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.715

10k+ parts

$0.638

1,500

-

-

$0.715

$0.638

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,458 parts In-Stock

1+ parts

$0.490

100+ parts

-

1k+ parts

-

10k+ parts

-

1,458

$0.490

-

-

-

Vyrian

USA . 7,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,801

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,190 parts In-Stock

1+ parts

$0.464

100+ parts

-

1k+ parts

-

10k+ parts

-

3,190

$0.464

-

-

-

Parana Technologies

USA . 367 parts In-Stock

1+ parts

$26.186

100+ parts

-

1k+ parts

$26.774

10k+ parts

-

367

$26.186

-

$26.774

-

IDEA Electronic Components Group

UK . 1,969 parts In-Stock

1+ parts

$29.422

100+ parts

$27.951

1k+ parts

$26.480

10k+ parts

-

1,969

$29.422

$27.951

$26.480

-

ChromeModa Solutions

Germany . 1,269 parts In-Stock

1+ parts

$29.422

100+ parts

$24.126

1k+ parts

-

10k+ parts

-

1,269

$29.422

$24.126

-

-

Andel Nordic

Denmark . 248 parts In-Stock

1+ parts

$36.177

100+ parts

-

1k+ parts

$34.730

10k+ parts

$34.730

248

$36.177

-

$34.730

$34.730

Microchip USA

USA . 2,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,174

-

-

-

-

DigiPath Technology Company

USA . 325 parts In-Stock

1+ parts

-

100+ parts

$26.527

1k+ parts

-

10k+ parts

-

325

-

$26.527

-

-

Overview

Enhance your electronic systems with the SN74LV373APWT by Texas Instruments, a top-of-the-line Bus Driver & Transceiver. Crafted with precision and expertise, this product offers seamless integration and reliable performance. Ideal for a wide range of applications, this component provides unparalleled value and efficiency. Elevate your projects with the quality and innovation that Texas Instruments is renowned for. Trust in the SN74LV373APWT to deliver exceptional results and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to impact, making this product suitable for rugged environments.

Propagation Delay At Nominal Supply: 17 ns

Low propagation delay ensures fast signal transmission, making this product efficient for quick communication in bus systems.

Surface Mount: YES

Surface mount design allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage / Vsup (V): 2.5

Low nominal supply voltage helps in reducing power consumption and increasing overall efficiency.

Maximum I (ol): 16 Amp

High maximum output current capability allows for driving heavy loads, making this product versatile for various applications.

Temperature Grade: AUTOMOTIVE

Automotive grade temperature range ensures reliable performance in harsh temperature conditions, ideal for automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Bus Driver & Transceivers SN74LV373APWT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

17 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74LV373APWT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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