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SN74LV373ADWRG4

Texas Instruments

SN74LV373ADWRG4 by Texas Instruments

SN74LV373ADWRG4 by Texas Instruments is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage of 2V to 5.5V, with a propagation delay of 17ns and max power supply current of 0.02mA. Ideal for automotive applications due to its small outline package and enable low control type.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 16,260 parts In-Stock

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Vyrian

USA . 8,980 parts In-Stock

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8,980

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Digiode

USA . 3,726 parts In-Stock

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3,726

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Distributors (Availability)

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AZTECH Wire

Italy . 452 parts In-Stock

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$19.620

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452

$19.620

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Parana Technologies

USA . 1,111 parts In-Stock

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$27.937

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$41.885

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$27.937

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$41.885

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ChromeModa Solutions

Germany . 6,797 parts In-Stock

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$31.390

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$25.740

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6,797

$31.390

$25.740

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IDEA Electronic Components Group

UK . 155 parts In-Stock

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$31.390

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$29.820

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$28.251

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155

$31.390

$29.820

$28.251

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One Stop Electronics

USA . 1,471 parts In-Stock

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$41.000

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$41.000

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Andel Nordic

Denmark . 3,481 parts In-Stock

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$94.966

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$91.168

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$91.168

3,481

$94.966

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$91.168

Component Stockers USA

USA . 777 parts In-Stock

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$99.990

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777

$99.990

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Microchip USA

USA . 2,858 parts In-Stock

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2,858

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DigiPath Technology Company

USA . 2,093 parts In-Stock

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$28.301

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$28.301

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Corphita

USA . 986 parts In-Stock

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Overview

Unlock seamless data transfer and reliable performance with the SN74LV373ADWRG4 by Texas Instruments. Crafted with precision and expertise, this Bus Driver & Transceiver is designed to deliver unparalleled quality and efficiency. Ideal for a wide range of applications, this product offers customers unmatched value and benefits. Say goodbye to connectivity issues and hello to smooth operations with the SN74LV373ADWRG4. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 17 ns

Low propagation delay ensures faster signal transmission, making this product ideal for applications where quick response times are critical.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 2.5

The low nominal supply voltage requirement makes this product energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it suitable for automotive applications.

Output Characteristics: 3-STATE

The 3-state output characteristics allow the bus driver & transceivers to control multiple bus lines, providing flexibility and versatility in data transmission.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product reliable and efficient in various operating environments.

Technical Specifications

Bus Driver & Transceivers SN74LV373ADWRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

16 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

17 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN74LV373ADWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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