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SN74LS00PSRG4

Texas Instruments

SN74LS00PSRG4 by Texas Instruments

SN74LS00PSRG4 by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It has a propagation delay of 15 ns at 5V, suitable for commercial temperature grades. This small outline package with gull wing terminals is ideal for surface mount applications requiring fast signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,365 parts In-Stock

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Vyrian

USA . 2,091 parts In-Stock

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2,091

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Distributors (Availability)

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AZTECH Wire

Italy . 428 parts In-Stock

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$5.853

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428

$5.853

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Parana Technologies

USA . 1,116 parts In-Stock

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$17.187

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$17.404

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$17.187

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$17.404

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DigiPath Technology Company

USA . 1,754 parts In-Stock

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$18.925

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$17.411

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1,754

$18.925

$17.411

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ChromeModa Solutions

Germany . 5,059 parts In-Stock

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$19.311

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$15.835

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5,059

$19.311

$15.835

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IDEA Electronic Components Group

UK . 812 parts In-Stock

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$19.311

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$18.345

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$17.380

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812

$19.311

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$17.380

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One Stop Electronics

USA . 1,588 parts In-Stock

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$50.000

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Component Stockers USA

USA . 345 parts In-Stock

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$99.990

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Corphita

USA . 2,764 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 1,322 parts In-Stock

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Overview

Get ready to experience top-notch quality and reliability with the SN74LS00PSRG4 by Texas Instruments! As a leading manufacturer in the industry, Texas Instruments delivers exceptional logic gates that are perfect for a wide range of applications. With a compact package style and low propagation delay, this product offers unmatched performance and efficiency. Say goodbye to delays and hello to seamless operation with the SN74LS00PSRG4. Upgrade your projects today with this high-value component from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, reducing the risk of damage during handling and installation.

Propagation Delay At Nominal Supply: 15 ns

The low propagation delay ensures quick signal processing, making this logic gate suitable for applications requiring fast response times.

Surface Mount: YES

Being surface mountable, this logic gate can be easily integrated into compact electronic devices and circuit boards.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this logic gate is compatible with standard power sources, making it easy to incorporate into existing systems.

No. of Inputs: 2

Having 2 inputs allows for simple logic operations to be performed, making this logic gate suitable for basic digital circuit designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this logic gate can withstand high temperature environments, increasing its versatility in various applications.

Technology: TTL

Utilizing TTL technology ensures compatibility with other TTL devices, simplifying integration and communication within a digital system.

Technical Specifications

Logic Gates SN74LS00PSRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

6.2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

4.4 mA

Propagation Delay At Nominal Supply:

15 ns

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

SN74LS00PSRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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