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SN74HCT645PWRE4

Texas Instruments

SN74HCT645PWRE4 by Texas Instruments

SN74HCT645PWRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 28 ns at 5V. It features a small outline package, operates in industrial temperatures (-40 to 85 °C), and has a max supply voltage of 5.5V. Ideal for bidirectional data transmission in various electronic applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,215 parts In-Stock

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8,215

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Digiode

USA . 4,928 parts In-Stock

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4,928

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,760 parts In-Stock

1+ parts

$16.093

100+ parts

-

1k+ parts

$16.424

10k+ parts

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1,760

$16.093

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$16.424

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DigiPath Technology Company

USA . 218 parts In-Stock

1+ parts

$17.720

100+ parts

$16.303

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-

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218

$17.720

$16.303

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ChromeModa Solutions

Germany . 4,455 parts In-Stock

1+ parts

$18.082

100+ parts

$14.827

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4,455

$18.082

$14.827

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IDEA Electronic Components Group

UK . 7 parts In-Stock

1+ parts

$18.082

100+ parts

$17.178

1k+ parts

$16.274

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7

$18.082

$17.178

$16.274

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AZTECH Wire

Italy . 491 parts In-Stock

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$19.352

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491

$19.352

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One Stop Electronics

USA . 161 parts In-Stock

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$47.000

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161

$47.000

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Andel Nordic

Denmark . 902 parts In-Stock

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$555.608

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$533.383

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$533.383

902

$555.608

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$533.383

$533.383

Microchip USA

USA . 3,380 parts In-Stock

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3,380

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Corphita

USA . 1,471 parts In-Stock

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Overview

Built by renowned manufacturer Texas Instruments, the SN74HCT645PWRE4 offers top-notch quality and reliability in the Bus Driver & Transceivers category. This versatile product provides seamless communication between different components while boasting a low propagation delay and high output characteristics. Ideal for industrial applications, this dual-terminal device operates within a wide temperature range and offers true output polarity. Customers can trust in the value and benefits that this innovative product brings to their projects, making it a smart choice for any application requiring efficient data transmission.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and ensures the component is able to withstand various environmental conditions.

Propagation Delay At Nominal Supply: 28 ns

The low propagation delay ensures fast signal transmission, making this product suitable for applications that require quick response times.

Surface Mount: YES

Being surface mountable, this bus driver & transceiver can be easily integrated into compact electronic designs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides a stable power source for consistent performance of the device.

Propagation Delay (tpd): 38 ns

With a low propagation delay of 38 ns, this product ensures efficient communication between components in a system.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the energy efficiency and reliability of this bus driver & transceiver.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial temperature ranges, this product is suitable for use in harsh environments where temperature fluctuations are common.

Technical Specifications

Bus Driver & Transceivers SN74HCT645PWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

HCT

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

28 ns

Propagation Delay (tpd):

38 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74HCT645PWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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